Patents by Inventor James Edward Van Ryswyk

James Edward Van Ryswyk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer apparatus suitable for use in a circuit board assembly
    Patent number: 5831826
    Abstract: A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: November 3, 1998
    Assignee: Motorola, Inc.
    Inventor: James Edward Van Ryswyk