Patents by Inventor James Edward Vianco, Sr.

James Edward Vianco, Sr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inclined feature to protect printhead face
    Patent number: 7862147
    Abstract: A printhead has a substrate with a mounting surface for a printhead die. The printhead die includes a first face bonded to the mounting surface of the substrate and a second face opposite the first face. The second face including at least one array of marking elements disposed along a marking element array direction. An edge of the printhead die is substantially parallel to the marking element array direction. An inclined surface is positioned proximate to, but not overlapping the edge of the printhead die, wherein a distance from the inclined surface to the mounting surface of the substrate at a first location is greater than a distance from the inclined surface to the mounting surface of the substrate at a second location, the first location also being nearer the edge of the printhead die that is substantially parallel to the marking element array direction than the second location.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: January 4, 2011
    Assignee: Eastman Kodak Company
    Inventors: Mario Joseph Ciminelli, Douglas Harold Pearson, James Edward Vianco, Sr.
  • INCLINED FEATURE TO PROTECT PRINTHEAD FACE
    Publication number: 20100079542
    Abstract: A printhead has a substrate with a mounting surface for a printhead die. The printhead die includes a first face bonded to the mounting surface of the substrate and a second face opposite the first face. The second face including at least one array of marking elements disposed along a marking element array direction. An edge of the printhead die is substantially parallel to the marking element array direction. An inclined surface is positioned proximate to, but not overlapping the edge of the printhead die, wherein a distance from the inclined surface to the mounting surface of the substrate at a first location is greater than a distance from the inclined surface to the mounting surface of the substrate at a second location, the first location also being nearer the edge of the printhead die that is substantially parallel to the marking element array direction than the second location.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Inventors: Mario Joseph Ciminelli, Douglas Harold Pearson, James Edward Vianco, SR.