Abstract: The present invention relates to cyclopropylamide compounds that are useful in the treatment of parasitic infestations of fish. The compounds have the formula (I).

Abstract: A conditional thunk utility employing an assembler-level direct-branch thunk technique. In a condition-check alternative, the conditional thunk utility performs a condition check followed by a direct-branch jump. The condition-check methodology is implemented using an assembler-level direct-branch technique, and the conditional thunk utility does not utilize the stack to queue the arguments of a function call. Thus, the stack is not altered from its desired condition just prior to executing the API function call. The condition-check alternative checks the thunk condition for each function call and, for this reason, may be used when the thunk condition can vary relatively frequently while the host computer system is running. In a jump-table alternative, the conditional thunk utility performs an assembler-level jump table check followed by a direct jump to a target address.

Abstract: Installing files on a hard disk drive in a manner that improves program launch time. After a build of a program is completed, the program is launched and the disk activity associated with disk-intensive operations is monitored to determine the order in which file portions are read from a disk during program or command launch. This data is used to create a load sequence list, which indicates the order in which various portions of the files are read during launch. The installation disks include the files and the load sequence list. During the installation process, the installation program reads the data from the load sequence list and writes the file portions so they are stored in the order prescribed by the load sequence list in contiguous clusters on the hard disk drive.

Abstract: An improved method of making a multiple print thick film circuit wherein the alignment between successive conductor print steps is both optically inspectable and electrically testable. The first of two or more successive conductor print layers includes a pair of adjacent alignment features with a non-conductive gap therebetween, and the successive conductor print layer includes a pair of identical alignment features which are printed directly on top of the alignment feature pair of the first print layer. When the successive print layer is properly aligned with the first print layer, the non-conductive gap between the alignment features of the first print layer will be preserved, and test probes brought into contact with the features or associated probe pads will reveal a high or open-circuit impedance therebetween.

Abstract: An improved method of manufacturing thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The method utilizes a dielectric material that can be co-fired with an underlying conductor, and preferably, that remains porous after firing. A layer of the dielectric material (FDL) is printed atop a dried but not yet fired conductor of the first circuit layer, and then co-fired with the conductor. Spreading of the FDL prior to firing is minimized due to the porosity of the dried but unfired conductor, which absorbs solvent from the FDL. The FDL can be printed in a ring, enclosing a portion of the underlying conductor to form a via definition ring, or VDR.

Abstract: An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired.

Abstract: A screen printing device for screen printing a thick film ink through a screen so as to form a highly-defined thick film on a surface of a microelectronics circuit. The screen printing device achieves the above by bypassing excess ink that would otherwise accumulate ahead of the squeegee device, thereby limiting the pressure lead length ahead of the device during the screen printing process. As such, the screen is able to form an adequate seal with the surface of the substrate to prevent ink from bleeding out under the screen, i.e., between the screen and substrate. The result is a well-defined thick film on the substrate, and avoids the necessity of stopping the printing operation in order to remove ink from the lower surface of the screen. The screen printing device enables a method by which well-defined films can be readily deposited at high throughput levels, without necessitating additional procedures, equipment and techniques that might otherwise further complicate the printing process.