Abstract: Systems and methods for manipulating the temperature of a surface are described. Described embodiments include thermal adjustment devices that may include a heatsink and that are operated in two or more modes of operation to apply a desired temperature to a user. In one operating mode the thermal adjustment device may apply a first temperature to an underlying surface while generating heat at a rate faster than the heatsink's heat dissipation rate. The thermal adjustment device may then apply a second temperature to reduce the rate of heat generation to be less than the heatsink's heat dissipation rate. These modes of operation may be applied cyclically to permit continuous operation of the thermal adjustment device. In some embodiments, the temperature profile applied when changing between the modes of operation may be selected such that the user experiences either a reduced, or substantially, neutral thermal sensation.

Abstract: Systems and methods for manipulating the temperature of a surface are described. Described embodiments include thermal adjustment devices that may include a heatsink and that are operated in two or more modes of operation to apply a desired temperature to a user. In one operating mode the thermal adjustment device may apply a first temperature to an underlying surface while generating heat at a rate faster than the heatsink's heat dissipation rate. The thermal adjustment device may then apply a second temperature to reduce the rate of heat generation to be less than the heatsink's heat dissipation rate. These modes of operation may be applied cyclically to permit continuous operation of the thermal adjustment device. In some embodiments, the temperature profile applied when changing between the modes of operation may be selected such that the user experiences either a reduced, or substantially, neutral thermal sensation.