Abstract: Optical element including an optical metastructure composed, at least in part, of cone-shaped or truncated-shaped meta-atoms, such as pyramid-shaped or frustum-shaped meta-atoms, method of manufacturing the optical element, and optical device comprising the optical element. The manufacturing may include the use of sputtering to deposit the material for the meta-atoms, which may be embedded, for example, in a polymer layer. The optical element might be composed of a stack of two metastructured layers.

Abstract: A method for manufacturing thermoelectric generators or other devices includes imprinting a first replication layer to form a first metastructure, and imprinting a second replication layer to form a second metastructure. The first replication layer is composed of nanoparticles embedded in a polymer, and is disposed on a surface of a first substrate that includes first electrical contacts. The second replication layer also is composed of nanoparticles embedded in a polymer, and is disposed on a surface of a second substrate that includes second electrical contacts. The method includes bonding meta-atoms of the second metastructure to the first electrical contacts, and bonding meta-atoms of the first metastructure to the second electrical contacts, such that respective ones of the meta-atoms of the first metastructure are connected electrically in series with respective ones of the meta-atoms of the second metastructure.

Abstract: An example method includes pressing a face of a stamp into a replication material disposed on a substrate, to cause the replication material to have a predetermined characteristic, in which a plurality of nano-sized microwave susceptors are embedded in the replication material, curing the replication material by applying microwaves to the replication material, and removing the face of the stamp from contact with the replication material.

Abstract: A method includes pressing a face of a stamp into a replication material disposed on a substrate, to cause the replication material to have a predetermined characteristic, in which a plurality of nanoparticles are embedded in the replication material, the plurality of nanoparticles having a size distribution with a first local maximum at a first diameter and a second local maximum at a second, different diameter, and in which the plurality of nanoparticles includes a first subset of nanoparticles having diameters closer to the first diameter than to the second diameter and a second subset of nanoparticles having diameters closer to the second diameter than to the first diameter; curing the replication material; and removing the face of the stamp from contact with the replication material.

Abstract: An optical device includes an array of light-emitting elements, including a first subset of light-emitting elements and a second subset of light-emitting elements. The first subset of light-emitting elements is configured to emit light having wavelength L1. The device includes a high refractive index material selectively disposed on the second subset of light-emitting elements and an array of optical elements positioned so as to be illuminated by the first subset of light-emitting elements and by the second subset of light-emitting elements. The optical elements are regularly arranged in a common plane at a pitch P, the common plane is located a distance D from the array of light-emitting elements, and P2?2L1D/N, N being an integer greater than or equal to 1.

Abstract: A method for use in manufacturing an optical emitter arrangement comprises holding an electrically conductive base member and two electrically conductive base elements in a predetermined spatial relationship, and providing two electrically conductive projections, wherein each projection extends in a direction away from a surface of a corresponding one of the base elements and wherein each projection terminates at a corresponding outer end. The method further comprises bringing a projecting portion of a surface profile of a mold tool into engagement with an area of a surface of the base member whilst bringing other portions of the surface profile of the mold tool into engagement with the outer ends of the projections so as to form a void that extends away from the surface of the base member around the projecting portion of the surface profile of the mold tool and that extends away from the surface of each of the base elements around each projection without extending over the outer end of each projection.

Abstract: Described herein are methods of transdifferentiating preadipocytes, populations of transdifferentiated preadipocytes, and methods of using the transdifferentiated preadipocytes.

Abstract: An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.

Abstract: Methods of manufacturing an optical device can include, in some implementations, providing a substrate having a first polymeric layer on a surface of the substrate and a second polymeric layer on the first polymeric layer, forming first openings in the second polymeric layer to define an etch mask composed of material of the second polymeric layer, and etching to form second openings in the first polymeric layer, wherein locations of the second openings are defined by the etch mask. A material is deposited in the second openings to form meta-atoms of a first metastructure, wherein adjacent ones of the meta-atoms are separated from one another by polymeric material of the first polymeric layer. Optical devices including metastructures can be formed, where meta-atoms of the metastructure have a relatively high aspect ratio.

Abstract: An optical device includes an array of light-emitting elements, including a first subset of light-emitting elements and a second subset of light-emitting elements. The first subset of light-emitting elements is configured to emit light having wavelength L1. The device includes a high refractive index material selectively disposed on the second subset of light-emitting elements and an array of optical elements positioned so as to be illuminated by the first subset of light-emitting elements and by the second subset of light-emitting elements. The optical elements are regularly arranged in a common plane at a pitch P, the common plane is located a distance D from the array of light-emitting elements, and P2?2L1D/N, N being an integer greater than or equal to 1.

Abstract: Illumination modules are operable, in some implementations, to project a homogenous diffuse illumination onto a scene. Some implementations allow different subsets of light emitting elements to be addressed independently so that they can be turned on (or off) at different times, which can facilitate multi-mode operation.

Abstract: Manufacturing an optical device includes providing a substrate (102) having a polymeric layer (104) on a surface of the substrate, forming openings in the polymeric layer, and depositing a material in the openings to form meta-atoms (114, 214) of a first metastructure. Adjacent ones of the meta-atoms are separated from one another by polymeric material of the polymeric layer. Optical devices that include one or more metastructures in which meta-atoms are separated from one another by polymeric material are described, as are modules that incorporate the optical devices.

Abstract: An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.

Abstract: An optoelectronic device has an asymmetric field overlap and is operable to measure proximity independently of object surface reflectivity. In some instances, the optoelectronic device includes a plurality of light-emitting assemblies and a light-sensitive assembly. In some instances, the optoelectronic devices include a plurality of light-sensitive assemblies and a light-emitting assembly. An asymmetric field overlap is attained in various implementations via various field-of-view axis, field-of-view angle, field-of-illumination axis, field-of-illumination angle, optical element and/or pitch configurations.

Abstract: An example system includes a light source, a first spectrometer, a second spectrometer, and an electronic control module. The light source is operable to emit light within a first range of wavelengths in a field of illumination. The first spectrometer is operable to measure first sample light reflected from an object within a second range of wavelengths and in a first field of detection. The second spectrometer is operable to measure second sample light reflected from the object within a third range of wavelengths and in a second field of detection. The electronic control module operable to determine, based on the measured first sample light and the measured second sample light, a distance between the system and the object, and determine, based on the measured first sample light and the measured second sample light, a spectral distribution of light corresponding to the object.

Abstract: An example system includes a first spectrometer, a second spectrometer, and an electronic control device communicatively coupled to the first spectrometer and the second spectrometer. The first spectrometer is operable to emit first light using a first light source towards a sample region between the first spectrometer and the second spectrometer. The first spectrometer is also operable to measure first reflected light reflected using a first photodetector from an object in the sample region. The second spectrometer is operable to measure first transmitted light transmitted through the object using a second photodetector. The electronic control device is operable to determine, based on at least one of the measured first reflected light or the measured first transmitted light, a spectral distribution of light corresponding to the object.

Abstract: An illumination device includes an emission layer including a semiconductor-based light emitter; and an optical layer disposed on the emission layer. The optical layer includes an optical element, such as a lens, at least partially aligned with the semi-conductor-based light emitter. The optical layer is formed of a material having a negative coefficient of thermal expansion (CTE). For instance, the semiconductor-based light emitter is configured to emit light at a wavelength ?, and in which a pitch p of the MLA, a thickness z of the optical layer, and the wavelength ? satisfy a predefined relationship.

Abstract: A method of manufacturing an optical sensor arrangement including the steps of providing a substrate having a surface and providing an integrated circuit comprising an optical detector arranged for detecting light of a desired wavelength range. The integrated circuit and a light emitter are mounted onto the surface, wherein the light emitter is arranged for emitting light in the desired wavelength range. The integrated circuit and the light emitter are electrically connected to each other and to the substrate. A light barrier is formed between the optical detector and the light emitter by dispensing a first optically opaque material along a profile of the integrated circuit. A mold layer is formed by at least partly encapsulating the substrate, the integrated circuit and the light emitter with an optically transparent material. A casing, made from a second optically opaque material, is mounted on the light barrier and thereby encloses a hollow space between the casing and the mold layer.

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable spectral filter layer is produced which defines apertures. Then, trenches are produced which extend through the clear encapsulation and establish sidewalls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches and producing aperture stops. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.