Abstract: An electronic component assembly includes a flexible printed circuit, and further includes two components disposed on the flexible printed circuit, having electrical connections with the flexible printed circuit. The flexible layer is folded so that the components face each other and a thermal management device is disposed between the components. The thermal management device may be glued by a thermally conducting adhesive or otherwise held in a stable arrangement, in order to remove the heat generated from the components.

Abstract: A method for fabricating a substrate package for a high density interconnect multichip module stack comprises: providing a substrate having holes extending therethrough and having a bottom surface with metallization situated thereon; providing a metal sheet having grooves extending therethrough; attaching the metal sheet to the bottom surface of the substrate; attaching metal plugs through the holes to the metal sheet; and removing portions of the substrate to expose the metal plugs and separate the metal sheet into a plurality of segments defined by the grooves.