Patents by Inventor James F. Behlen

James F. Behlen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro BGA stacking scheme
    Patent number: 5598033
    Abstract: There is provided an improved stacking scheme for micro-BGA packages so as to provide a high density integrated circuit package. The integrated circuit package assembly (300) includes a sheet-like interposer (312) which is formed of a main portion (312a) and an extension (312b) extending outwardly from the main portion. A plurality of lands (326) are disposed on the surface of the interposer extension. A plurality of masses (314) of electrically conductive bonding material of each of a plurality of packages overlie the lands on the interposer extension of the next lower package and are electrically connected thereto when the plurality of packages are stacked one atop the other.
    Type: Grant
    Filed: October 16, 1995
    Date of Patent: January 28, 1997
    Assignee: Advanced Micro Devices, Inc.
    Inventors: James F. Behlen, Rafiqul Hussain, Munir Haq