Abstract: A high voltage distribution system and method for use with a cathode of a radiographic sensor device of a radiographic imaging apparatus are provided. The distribution system includes an insulated conductor formed on a first detector portion of the radiographic sensor device and communicating a high voltage to the cathode. The distribution system further includes an intermediate conduction portion communicating with the insulated conductor. The intermediate conduction portion includes a contact surface. The distribution system further includes a interconnect extending from a second portion of the radiographic sensor device. The separable interconnect communicates with an electrical voltage source and is positioned to come into contact with the intermediate conduction portion when the first detector portion of the radiographic sensor device is assembled to the second signal processing portion.

Abstract: A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like.

Abstract: A gamma camera having a system for performing a quality control procedure with minimal to no intervention from a user of the camera. In one aspect, the gamma camera includes a relatively weak radioactive source positioned at a fixed or known location relative to the gamma camera scintillation crystal and positioned so that the entrance window side of the crystal is facing the source, wherein the photons emitted from the source have an energy that is below the energy of photons used for diagnostic imaging. The response of the gamma camera photo-multiplier tubes to the absorption events caused by the radioactive source when the camera is idle can be compared to a baseline response to determine whether one or more of the PMTs need to be adjusted.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: A solid state gamma camera module and integrated thermal management method thereof includes a printed circuit board having a first thermal layer and a second thermal layer. The first thermal layer is thermally and/or electrically bonded to the second thermal layer. A semiconductor detector module having the temperature sensitive material electrically communicates with the second thermal layer. A plurality of the integrated circuits each having a bottom metal layer and wire bonds are electrically connected to the first thermal layer. A cover is electrically and thermally bonded to the first thermal layer and covers the plurality of integrated circuits. The first thermal layer extracts heat from the integrated circuits by direct interface to the bottom metal layer (or the second thermal layer), and the second thermal layer extracts heat from an integrated circuit (IC) interconnect. The IC interconnect can be through a wire bond, die bond, direct solder flip chip attachment or the like.

Abstract: A gamma camera having a system for performing a quality control procedure with minimal to no intervention from a user of the camera. In one aspect, the gamma camera includes a relatively weak radioactive source positioned at a fixed or known location relative to the gamma camera scintillation crystal and positioned so that the entrance window side of the crystal is facing the source, wherein the photons emitted from the source have an energy that is below the energy of photons used for diagnostic imaging. The response of the gamma camera photo-multiplier tubes to the absorption events caused by the radioactive source when the camera is idle can be compared to a baseline response to determine whether one or more of the PMTs need to be adjusted.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: A piezoelectric resonator (10) having a sacrificial mass-loading layer (16). Material is removed from the mass-loading layer (16) to raise a resonator frequency to a desired target. The sacrificial layer (16) is of a dense material, such as silver or gold, but is of such a relative thin layer that it can be used on high frequency aluminum electrodes (14) of a resonator (10) without increasing adverse spurious frequency problems. It is not necessary that the mass-loading layer (16) be conductive. In addition, the silver or gold sacrificial layer (16) can be removed by ion milling at practical and economical rates, unlike aluminum or aluminum oxide. Preferably, a diffusion barrier (18) is interposed between the electrodes (14) and the mass-loading layer (16).

Abstract: A piezoelectric resonator (12) is embedded within an electrically insulating substrate assembly (36), such as a multilayer printed circuit board. Electrical conductors (22,24) extend from electrodes of the resonator (12) through holes (32) in upper and lower layers (26,29) of the substrate assembly (36) and connect to electrical traces (34). The lower layer (29) has a pocket which forms a cavity (38) within the substrate assembly (36) adapted to contain the piezoelectric resonator (12). The conductors (22,24) support the resonator (12) such that the resonator (12) does not contact the assembly (36). As the resonator is substantially larger than associated electrical components, embedding it within a substrate eliminates the size penalty that is normally required to mount a large piezoelectric resonator.

Abstract: A resonator (104) including a piezoelectric plate (102) with an electrode (108) having a random pattern (100) along a portion of an edge of the electrode (108). The random pattern (100) dampens or destructively interferes with undesirable and inharmonic vibrational modes. For example, a rectangular AT-cut quartz resonator, which vibrates in a thickness-shear mode may also possess undesirable flexure and face-shear modes. These modes not only present undesirable spurious frequencies, they also change over temperature, disturbing a frequency-ternperature response of the resonator. The random pattern (100) causes diffuse and/or specular scattering to reduce these undesirable modes, providing a more uniform frequency-temperature response which is beneficial in temperature compensated crystal oscillator applications.

Abstract: A temperature compensation circuit (10) for a crystal oscillator module (12) used in a communication device (200). An existing microcontroller (210) of the communication device (200) is used to provide temperature compensating digital data (30) for a crystal oscillator (18). The temperature compensating digital data (30) is converted to a temperature compensation signal (22) in a digital-to-analog converter (32) which controls the crystal oscillator frequency. The crystal oscillator module (12) includes an onboard voltage regulator (34) which supplies a characterized regulated voltage (36) to the digital-to-analog converter (32) such that the temperature compensation signal (22) from the digital-to-analog converter (32) is inherently corrected for voltage variations in the voltage regulator (34). Changes in the temperature compensation of the crystal oscillator (18) are allowed only when the communication device (200) is not transmitting or receiving.