Patents by Inventor James F. Dentry

James F. Dentry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package with integrated inductor and/or capacitor
    Patent number: 7166493
    Abstract: Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: January 23, 2007
    Assignee: Honeywell International Inc.
    Inventors: James F. Dentry, Andrezej Peczalski
  • Package with integrated inductor and/or capacitor
    Publication number: 20040178473
    Abstract: Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
    Type: Application
    Filed: March 29, 2004
    Publication date: September 16, 2004
    Inventors: James F. Dentry, Andrezej Peczalski
  • Package with integrated inductor and/or capacitor
    Patent number: 6744114
    Abstract: Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: June 1, 2004
    Assignee: Honeywell International Inc.
    Inventors: James F. Dentry, Andrezej Peczalski
  • Package with integrated inductor and/or capacitor
    Publication number: 20030045044
    Abstract: Methods for attaching two wafers are presented along with devices resulting from such methods. In one illustrative embodiment, a first wafer is provided having pillars for conducting an electric signal. The wafer also includes an electronic device such as an inductor or capacitor that may in some instances consume relatively large amounts of space. The first wafer is bonded to a second wafer so that a circuit on the second wafer may be electrically connected to the electronic device of the first wafer.
    Type: Application
    Filed: August 28, 2002
    Publication date: March 6, 2003
    Applicant: Honeywell International Inc.
    Inventors: James F. Dentry, Andrezej Peczalski