Abstract: Systems and methods for processing sacrificial layers in MEMS device fabrication are provided. In one embodiment, a method comprises: applying a patterned layer of Aerogel material onto a substrate to form an Aerogel sacrificial layer; applying at least one non-sacrificial silicon layer over the Aerogel sacrificial layer, wherein the non-sacrificial silicon layer is coupled to the substrate through one or more gaps provided in the patterned layer of Aerogel material; and removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid.

Abstract: An optical component is provided. The optical component includes an optical-path portion including an arm-connecting portion and a lower portion, a first arm extending from a first end of the arm-connecting portion, and a second arm extending from a second end of the arm-connecting portion. The first arm has at least one resting feature and the second arm has at least one resting feature. The optical-path portion has an input surface. When the resting features of the first arm and the second arm are positioned on a top surface at short edges of a trench in a trench system, the optical-path portion is vertically aligned in the trench.

Abstract: An apparatus and method for providing isolation between components in microfabricated devices is provided. In one embodiment, a microfabricated device comprises: a base layer; a microfabricated component; and a non-sacrificial aerogel layer in contact with the microfabricated component and supporting the microfabricated thermal component on the base layer. The non-sacrificial aerogel layer is positioned to provide at least one of thermal, electrical or acoustic isolation between the microfabricated thermal component and the base layer.

Abstract: Systems and methods for processing sacrificial layers in MEMS device fabrication are provided. In one embodiment, a method comprises: applying a patterned layer of Aerogel material onto a substrate to form an Aerogel sacrificial layer; applying at least one non-sacrificial silicon layer over the Aerogel sacrificial layer, wherein the non-sacrificial silicon layer is coupled to the substrate through one or more gaps provided in the patterned layer of Aerogel material; and removing the Aerogel sacrificial layer by exposing the Aerogel sacrificial layer to a removal liquid.

Abstract: An optical bench communicates light through free space in a plurality of trenches formed in the bench, each of the trenches formed by deep ion reactive etching and defined by two opposing side walls, such that the free space is between the opposing side walls. An exemplary embodiment has a first trench operable to receive the beam of light and operable to communicate the beam of light through the free space in the first trench; an angled reflection side wall operable to receive the beam of light routed through the first trench and operable to reflect at least a portion of the beam of light; and a second trench operable to receive the portion of the beam of light reflected from the angled reflection side wall and operable to route the portion of the beam of light through the free space in the second trench.

Abstract: Method and apparatus are provided for a silicon substrate optical system for use in an interferometric fiber optic gyroscope (IFOG). A silicon substrate of the silicon substrate optical system is etched to receive optical components, including an input optical fiber, a pump source, a wavelength division multiplier, an isolator, a polarizing isolator, a beam splitting device, a PM tap coupler, a relative intensity noise (RIN) photodiode, a system photodiode, and an output optical fiber. The optical components are mounted on a silicon substrate to reduce the size and cost of the IFOG and increase reliability.

Abstract: An optical component is provided. The optical component includes an optical-path portion including an arm-connecting portion and a lower portion, a first arm extending from a first end of the arm-connecting portion, and a second arm extending from a second end of the arm-connecting portion. The first arm has at least one resting feature and the second arm has at least one resting feature. The optical-path portion has an input surface. When the resting features of the first arm and the second arm are positioned on a top surface at short edges of a trench in a trench system, the optical-path portion is vertically aligned in the trench.

Abstract: Method and apparatus are provided for a silicon substrate optical system for use in an interferometric fiber optic gyroscope (IFOG). A silicon substrate of the silicon substrate optical system is etched to receive optical components, including an input optical fiber, a pump source, a wavelength division multiplier, an isolator, a polarizing isolator, a beam splitting device, a PM tap coupler, a relative intensity noise (RIN) photodiode, a system photodiode, and an output optical fiber. The optical components are mounted on a silicon substrate to reduce the size and cost of the IFOG and increase reliability.

Abstract: Systems and methods are operable to focus light. An exemplary embodiment has a MEMS substrate, a first cylindrical lens having a first cylindrical surface, and a second cylindrical lens having a second cylindrical surface that is oriented perpendicular to the first cylindrical surface. Light passing through the first and second cylindrical lenses is focused.

Abstract: A fiber optic alignment device on a crystalline substrate support is disclosed. An exemplary embodiment embodied in a resonator fiber optic gyro is fabricated by a process of forming a crystalline substrate support structure operable to support the first end portion of the optical fiber and the second end portion of the optical fiber; forming a first end V-groove portion and a second end V-groove portion in the support structure; physically coupling the first end portion of the optical fiber to the first end V-groove portion; and physically coupling the second end portion of the optical fiber to the second end V-groove portion.

Abstract: Systems and methods are operable to focus light. An exemplary embodiment has a MEMS substrate, a first cylindrical lens having a first cylindrical surface, and a second cylindrical lens having a second cylindrical surface that is oriented perpendicular to the first cylindrical surface. Light passing through the first and second cylindrical lenses is focused.

Abstract: An improved resonator fiber-optic gyro (RFOG). An example RFOG includes a closed-coil resonator where counter-propagating laser beams are done by fiber couplers. Signals are extracted from the ring resonator using other fiber couplers. The fiber couplers may be fiber spliced couplers, free-space fiber-to-fiber coupling elements or comparable coupling devices. A silicon structure may be used to align components of the gyro or just the coupling elements. The resonator includes a hollow-core fiber.

Abstract: An RF MEMS switch having a beam composed of a material having a high resistivity and a large Young's modulus may provide a large restoring force, a large electrostatic force at a low actuation voltage, and good isolation between signal input and output. RF MEMS switch reliability may be improved by reducing failures due to stiction by providing a large restoring force. A reliable contact may be provided with a large electrostatic force.

Abstract: A nanoresonator device with high quality factor and method for fabricating the same is disclosed herein. The nanoresonator device generally includes an input electrode, an output electrode, a nanoresonator anchored at its motionless nodal points of its resonance modes by support beam(s) and/or anchor. The nanoresonator device can be fabricated on various wafers including a silicon on insulator (SOI) wafer, which includes an insulating layer and a heavily doped silicon layer. The nano structures with high quality factor can be patterned on a film utilizing nano fabrication tools and the patterned structures can be utilized as a mask to form permanent nano structures on the silicon layer by reactive ion etching (RIE). The insulating layer can be removed to form the anchor beams and a cavity by wet etching utilizing an etching solution.

Abstract: A MEMS device includes a P-N device formed on a silicon pin, which is connected to a silicon sub-assembly, and where the P-N device is formed on a silicon substrate that is used to make the silicon pin before it is embedded into a first glass wafer. In one embodiment, forming the P-N device includes selectively diffusing an impurity into the silicon pin and configuring the P-N device to operate as a temperature sensor.

Abstract: An Optical bench communicates light through free space in a plurality of trenches formed in the bench, each of the trenches formed by deep ion reactive etching and defined by two opposing side walls, such that the free space is between the opposing side walls. An exemplary embodiment has a first trench operable to receive the beam of light and operable to communicate the beam of light through the free space in the first trench; an angled reflection side wall operable to receive the beam of light routed through the first trench and operable to reflect at least a portion of the beam of light; and a second trench operable to receive the portion of the beam of light reflected from the angled reflection side wall and operable to route the portion of the beam of light through the free space in the second trench.

Abstract: A wafer for use in a MEMS device having two doped layers surrounding an undoped layer of silicon is described. By providing two doped layers around an undoped core, the stress in the lattice structure of the silicon is reduced as compared to a solidly doped layer. Thus, problems associated with warping and bowing are reduced. The wafer may have a pattered oxide layer to pattern the deep reactive ion etch. A first deep reactive ion etch creates trenches in the layers. The walls of the trenches are doped with boron atoms. A second deep reactive ion etch removes the bottom walls of the trenches. The wafer is separated from the silicon substrate and bonded to at least one glass wafer.

Abstract: A fiber optic alignment device on a crystalline substrate support is disclosed. An exemplary embodiment embodied in a resonator fiber optic gyro is fabricated by a process of forming a crystalline substrate support structure operable to support the first end portion of the optical fiber and the second end portion of the optical fiber; forming a first end V-groove portion and a second end V-groove portion in the support structure; physically coupling the first end portion of the optical fiber to the first end V-groove portion; and physically coupling the second end portion of the optical fiber to the second end V-groove portion.

Abstract: A wafer for use in a MEMS device having two doped layers surrounding an undoped layer of silicon is described. By providing two doped layers around an undoped core, the stress in the lattice structure of the silicon is reduced as compared to a solidly doped layer. Thus, problems associated with warping and bowing are reduced. The wafer may have a pattered oxide layer to pattern the deep reactive ion etch. A first deep reactive ion etch creates trenches in the layers. The walls of the trenches are doped with boron atoms. A second deep reactive ion etch removes the bottom walls of the trenches. The wafer is separated from the silicon substrate and bonded to at least one glass wafer.

Abstract: An integrated three-dimensional magnetic or any field sensing device and a method to fabricate an integrated three-dimensional magnetic sensing device is presented. An integrated three-dimensional magnetic sensing device comprises an apparatus that defines at least a first surface area and at least one sloped surface which is sloped with respect to the first surface area. Two magnetic sensing units could be arranged on the first surface area to provide first and second orthogonal sensing directions, and a third magnetic sensing unit could be arranged on the at least one sloped surface to provide sensing in at least a third sensing direction which is orthogonal to the first and second orthogonal sensing directions. Bias could be applied to the third magnetic sensing unit to cancel a component of the magnetic field sensed by the third magnetic sensing unit so that the third magnetic sensor unit only provides sensing in the third direction.