Abstract: An antenna element can include a feed and a radiating element and a dielectric substrate having a first surface and a second surface, the dielectric substrate comprising the feed of the antenna element within the dielectric substrate. The antenna element module can also include an integrated circuit (IC) chip adhered to the first surface the dielectric substrate and coupled to the feed of the antenna element. The IC chip can include a circuit to adjust a signal communicated with the feed. The antenna element module can further include a plastic antenna carrier adhered to the second surface of the dielectric substrate. The plastic antenna carrier can include a body portion comprising a cavity for the radiating element of the antenna element, the radiating element positioned in the cavity of the body portion of the plastic antenna carrier.

Abstract: An antenna element can include a feed and a radiating element and a dielectric substrate having a first surface and a second surface, the dielectric substrate comprising the feed of the antenna element within the dielectric substrate. The antenna element module can also include an integrated circuit (IC) chip adhered to the first surface the dielectric substrate and coupled to the feed of the antenna element. The IC chip can include a circuit to adjust a signal communicated with the feed. The antenna element module can further include a plastic antenna carrier adhered to the second surface of the dielectric substrate. The plastic antenna carrier can include a body portion comprising a cavity for the radiating element of the antenna element, the radiating element positioned in the cavity of the body portion of the plastic antenna carrier.

Abstract: A mold compound made from a polymer resin and an isorefringent, transparent filler is used to form optical electronic components (10, 20, 30). The mold compound can be used to form a lens (13) on a display device (10), to form the outer housing (21) of a waveguide (20), or to form a dome (34) that reflects light from a light emitting device (32) to a light detecting device (33).

Abstract: A method for making a light weight circuit module includes steps of providing a substrate, drilling through holes in the substrate and plating the through holes with a metal. The substrate is a rigid planar substrate and having metallization on both sides. The method also includes steps of drilling through holes in the substrate and plating the through holes with a metal. The method also includes steps of preparing a patterned photoresist layer on at least one of the two sides, etching the metallization on the at least one side in accordance with the patterned photoresist layer, drilling support holes, filling the support holes with a material chemically distinct from the substrate, stripping the patterned photoresist layer from the at least one side and chemically removing the substrate from the metallization.

Abstract: A microwave absorbing ablating material is used as the ablative covering between the transmitting and receiving antennas while a standard ablating material, allowing the transmission of signals, is placed about the antennas. This allows signals to be transmitted from and received by the object covered by RF absorbing ablating material while preventing the transmission of signals transversely through the material. The RF absorbing, ablating material is made by combining an RF absorbing material with an ablating material in sufficient quantities to absorb and dissipate any signals that may be exposed to the ablative material.

Abstract: A method for potting and encapsulating electronic circuits by providing a homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, intermixing the resin-curing agent and microspheres in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight, enclosing the electronic circuit with a form, pouring the homogeneous mixture in the form to surround one electronic circuit, and heating the mixture to the required temperature for curing.

Abstract: A homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, with the resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.