Patents by Inventor James F. Machir

James F. Machir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10436664
    Abstract: Embodiments relate generally to a sensor device, method, and system are provided for housing a sensor. An example force sensor includes an actuation element, a sense die, and a universal housing for holding a sense die. The universal housing has a top wall, a bottom wall, two side walls, and a back wall that define a cavity. The sense die is disposed within the cavity. The top wall defines an aperture having a first central axis therethrough. The housing defines an opening between the top wall and bottom wall extending from an exterior of the housing to the cavity. The opening has a second central axis and is configured to receive the sense die therethrough. At least a portion of the actuation element extends from the cavity through the aperture. The first central axis is orthogonal to the second central axis.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: October 8, 2019
    Assignee: Honeywell International Inc.
    Inventors: James F. Machir, Richard Wade, Jason Dennis Patch
  • Patent number: 10330540
    Abstract: A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: June 25, 2019
    Assignee: Honeywell International Inc.
    Inventors: James F. Machir, Richard Wade, Jason Dennis Patch
  • Publication number: 20190064010
    Abstract: A force sensor or sensor assembly may include a sense die, a housing, and a force transmitting member. The sense die may include a force sensing region and at least one bond pad. The housing may include a sense die receiving cavity, at least one electrical terminal configured to engage a bond pad of the sense die, a retention member configured to prevent the sense die from sliding out of the housing, and a hole in the housing that exposes the force sensing region of the sense die to the force transmitting element. The housing may include one or more component parts. In some cases, the force sensor or sensor assembly may be configured on a microscale through micro-manufacturing techniques.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 28, 2019
    Inventors: James F. Machir, Richard Wade, Jason Dennis Patch
  • Publication number: 20180340855
    Abstract: A force sensor may comprise a universal housing for holding a sense die. Typically, the universal housing may comprise a top wall, a bottom wall, two side walls, and a back wall. The housing may comprise an aperture located on the top wall to allow for interaction of an actuation element with an external force and the surface of the sense die. Additionally, the universal housing may comprise a cavity/opening to allow for the insertion of the sense die. Generally, the bottom wall of the housing may comprise one or more electrical connections for alignment with the bond pads on the sense die. The electrical connections may comprise electrical traces formed by laser selective plating and/or insert molded studs. Typically, the electrical connections may be formed after the universal housing is formed by injection molding to allow for customization based on a Customer's specific application.
    Type: Application
    Filed: May 24, 2017
    Publication date: November 29, 2018
    Inventors: James F. Machir, Richard Wade, Jason Dennis Patch
  • Patent number: 10001418
    Abstract: Embodiments generally relate to device and methods for detecting force. A force sensor may include a sense die, a substrate, one or more sense elements supported by the sense die, one or more electrical contacts located on the sense die and electrically coupled to electrical traces on the substrate, and an actuation element configured to transmit a force to the sense die. The width of the actuation element may be less than the distance between the one or more electrical contacts. In some embodiments, the actuation element may include a thin wedge/plate configured to interact with the sense die at a contact point. The thin wedge/plate may allow use of a smaller sense die and/or may allow closer placement of the one or more sense elements to the contact point and/or may prevent accidental contact with the one or more electrical contacts which may lead to a short circuit.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: June 19, 2018
    Assignee: Honeywell International Inc.
    Inventors: James F. Machir, Jason Dennis Patch