Patents by Inventor James F. Muska

James F. Muska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via fill compositions for direct attach of devices and methods for applying same
    Patent number: 5571593
    Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: November 5, 1996
    Assignee: International Business Machines Corporation
    Inventors: Roy L. Arldt, Christina M. Boyko, Burtran J. Cayson, Richard M. Kozlowski, Joseph D. Kulesza, John M. Lauffer, Philip C. Liu, Voya R. Markovich, Issa S. Mahmoud, James F. Muska, Kostas Papathomas, Joseph G. Sabia, Richard A. Schumacher