Patents by Inventor James Fincke

James Fincke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060175125
    Abstract: The invention provides methods and apparatus for detecting seismic waves propagating through a subterranean formation surrounding a borehole. In a first embodiment, a sensor module uses the rotation of bogey wheels to extend and retract a sensor package for selective contact and magnetic coupling to casing lining the borehole. In a second embodiment, a sensor module is magnetically coupled to the casing wall during its travel and dragged therealong while maintaining contact therewith. In a third embodiment, a sensor module is interfaced with the borehole environment to detect seismic waves using coupling through liquid in the borehole. Two or more of the above embodiments may be combined within a single sensor array to provide a resulting seismic survey combining the optimum of the outputs of each embodiment into a single data set.
    Type: Application
    Filed: March 16, 2006
    Publication date: August 10, 2006
    Inventors: Phillip West, James Fincke, Teddy Reed
  • Publication number: 20050164016
    Abstract: The invention includes methods of forming a metallic coating on a substrate which contains silicon. A metallic glass layer is formed over a silicon surface of the substrate. The invention includes methods of protecting a silicon substrate. The substrate is provided within a deposition chamber along with a deposition target. Material from the deposition target is deposited over at least a portion of the silicon substrate to form a protective layer or structure which contains metallic glass. The metallic glass comprises iron and one or more of B, Si, P and C. The invention includes structures which have a substrate containing silicon and a metallic layer over the substrate. The metallic layer contains less than or equal to about 2 weight % carbon and has a hardness of at least 9.2 GPa. The metallic layer can have an amorphous microstructure or can be devitrified to have a nanocrystalline microstructure.
    Type: Application
    Filed: August 13, 2004
    Publication date: July 28, 2005
    Inventors: Daniel Branagan, Timothy Hyde, James Fincke