Abstract: A cap for an injection device includes a removable needle boot for covering a needle of a syringe within the injection device. The cap comprises a cap body and a first boot engagement portion. The first boot engagement portion is movable relative to the cap body and comprises a first pinch portion. The first pinch portion is configured such that application of compressive force to the first pinch portion effects engagement of the first boot engagement portion with the needle boot for removal of the needle boot with the cap as it is removed from the injection device.

Abstract: A leak detector for detecting and locating leaks in a water supply pipe of plastics, the leak detector comprising a first sensor at a first position arranged to detect a leak signal travelling along a pipe, a second sensor arranged to detect a leak signal travelling along the pipe at a second position spaced from the first position, and a processing device adapted to receive the signals from the first sensor and the second sensor. The processing device may be adapted to determine the velocity of the signals from characteristics of the leak signals. The processing device is adapted to use the velocity and distance between the first sensor and the second sensor to determine the location of a leak. The characteristics may be the relationship between the phase and frequency of the leak signals.

Abstract: The invention relates to a microprocessor and a method of operation thereof. More particularly this invention relates to a microprocessor, having at least three pipeline execution units which operate in lockstep. In an embodiment, the method of operation of a microprocessor accounts for the occurrence of transient faults or Single Event Upsets in one of its pipeline execution units such that their occurrence is unlikely to result in failure of the microprocessor as a whole.

Abstract: Thermal interface materials are described herein that include at least one phase change material, and at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material. Methods of producing thermal interface materials are also described that include providing at least one phase change material; providing at least one solvent, solvent mixture or combination thereof, wherein the at least one solvent, solvent mixture or combination thereof at least partially solvates the at least one phase change material; and physically coupling the at least one phase change material and the at least one solvent, solvent mixture or combination thereof.

Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

Abstract: The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

Abstract: A solder material has been produced and is described herein that comprises a conventional solder component, such as a solder sphere, solder ball, solder powder, solder preform, some other suitable material or form of solder or a combination thereof and a coating composition. Solder parts and/or solder materials described herein may be produced by a) providing a solder component, b) providing a coating precursor material, c) providing a solvent, d) blending the coating precursor material and the solvent, such that the coating precursor material is substantially solvated, to form a coating composition, and e) applying or coupling the coating composition to the solder component.

Abstract: Lead free solder compositions are described herein that include at least one solder material; at least one dopant material, wherein the dopant is present in the material in an amount of less than about 1000 ppm, and wherein the solder composition is substantially lead free. Several doped solder compositions described herein comprise at least one solder material, at least one phosphorus-based dopant and at least one copper-based dopant. Methods of forming doped solder materials include: a) providing at least one solder material; b) providing at least one phosphorus-based dopant; c) providing at least one copper-based dopant, and d) blending the at least one solder material, the at least one phosphorus-based dopant and the at least one copper-based dopant to form a doped solder material.