Abstract: Methods and systems for identifying inhibitors of Equilibrative Nucleoside Transporters are provided. Methods and systems for identifying inhibitors of Concentrative Nucleoside Transporters are also provided.

Abstract: Inhibitors of Plasmodium falciparum equilibrative nucleoside transporter type 1 are identified and methods of use as anti-parasitic compounds are provided.

Abstract: Inhibitors of Plasmodium falciparum equilibrative nucleoside transporter type 1 are identified and methods of use as anti-parasitic compounds are provided.

Abstract: Methods and systems for identifying inhibitors of Equilibrative Nucleoside Transporters are provided. Methods and systems for identifying inhibitors of Concentrative Nucleoside Transporters are also provided.

Abstract: One or more micromachined (MEMS) switches switch attenuators, such as resistors, into or out of a signal path, such as of a test instrument. The MEMS switches can be fabricated on the same substrate as the attenuators, or the switches or attenuators can be mounted on the same substrate as the others are fabricated. An instrument probe includes attenuators and MEMS switches that are controlled by the instrument and/or by a control circuit in the probe. Optionally, the probe includes reactive elements, such as capacitors, and MEMS switches to compensate for electrical characteristics of the probe and/or probe lead, and the probe or a test instrument automatically sets the MEMS switches to connect appropriate ones of the reactive elements to a signal path within the probe.

Abstract: One or more micromachined (MEMS) switches switch attenuators, such as resistors, into or out of a signal path, such as of a test instrument. The MEMS switches can be fabricated on the same substrate as the attenuators, or the switches or attenuators can be mounted on the same substrate as the others are fabricated. An instrument probe includes attenuators and MEMS switches that are controlled by the instrument and/or by a control circuit in the probe. Optionally, the probe includes reactive elements, such as capacitors, and MEMS switches to compensate for electrical characteristics of the probe and/or probe lead, and the probe or a test instrument automatically sets the MEMS switches to connect appropriate ones of the reactive elements to a signal path within the probe.

Abstract: One or more micromachined (MEMS) switches switch attenuators, such as resistors, into or out of a signal path, such as of a test instrument. The MEMS switches can be fabricated on the same substrate as the attenuators, or the switches or attenuators can be mounted on the same substrate as the others are fabricated. An instrument probe includes attenuators and MEMS switches that are controlled by the instrument and/or by a control circuit in the probe. Optionally, the probe includes reactive elements, such as capacitors, and MEMS switches to compensate for electrical characteristics of the probe and/or probe lead, and the probe or a test instrument automatically sets the MEMS switches to connect appropriate ones of the reactive elements to a signal path within the probe.

Abstract: In a first embodiment of the invention there is provided an electronic chip for use with an automatic testing equipment device testing a device under test. The device under test has a plurality of pins and the electronic chip is placed in a channel of a test card that is associated with one of the pins. An input signal is provided to a pin of the device under test and the resulting output is provided to the pin electronics for the channel of the test card. In most embodiments, the output signal is a voltage signal. One purpose for the electronic chip is to measure jitter based upon timing measurements performed by the electronic chip. Jitter measurements are particularly important for high-speed serial devices. The electronic chip includes an integrating time measurement circuit for receiving the input signal and producing an output signal including a timing measurement of at least a portion of the input signal.

Abstract: One or more micromachined (MEMS) switches switch attenuators, such as resistors, into or out of a signal path, such as of a test instrument. The MEMS switches can be fabricated on the same substrate as the attenuators, or the switches or attenuators can be mounted on the same substrate as the others are fabricated. An instrument probe includes attenuators and MEMS switches that are controlled by the instrument and/or by a control circuit in the probe. Optionally, the probe includes reactive elements, such as capacitors, and MEMS switches to compensate for electrical characteristics of the probe and/or probe lead, and the probe or a test instrument automatically sets the MEMS switches to connect appropriate ones of the reactive elements to a signal path within the probe.

Abstract: In a first embodiment of the invention there is provided an electronic chip for use with an automatic testing equipment device testing a device under test. The device under test has a plurality of pins and the electronic chip is placed in a channel of a test card that is associated with one of the pins. An input signal is provided to a pin of the device under test and the resulting output is provided to the pin electronics for the channel of the test card. In most embodiments, the output signal is a voltage signal. One purpose for the electronic chip is to measure jitter based upon timing measurements performed by the electronic chip. Jitter measurements are particularly important for high-speed serial devices. The electronic chip includes an integrating time measurement circuit for receiving the input signal and producing an output signal including a timing measurement of at least a portion of the input signal.

Abstract: In order to form a modular interface between a DUT board, which is housing devices under tests (DUT), to cables connected to a test head, a board spacer is provided that has an array of connectors. Each cable is connected to a respective connector, and the DUT board contains a corresponding array of connection points which are less than or equal to the number of connectors in the arrays on the board spacer. In this way, a common board spacer can be used to connect the cables to DUT boards housing different types of DUTs since the location of the connection points on the board spacer is known and kept constant. This interface allows a high speed and high fidelity connection between the test head and the devices on the DUTs for frequencies in excess of 50 MHz.

Abstract: A microdischarge device having a gas or vapor contained in a microcavity and in electrical contact with a semiconductor substrate, preferably a silicon wafer. A preferred structure includes successive cathode substrate or film, dielectric, and conductive anode layers with the anode and dielectric layers penetrated by a plurality of microcavities to allow electrical contact between the discharge medium and the substrate cathode layer. A hollow cathode structure includes a microcavity that penetrates the cathode. An optical waveguide network may be used in addition to collect and concentrate emission from groups of individual microcavities. The small aperture of the cavity area, of about 1 to 400 micrometers in diameter, enable the electrons in the discharge to be ballistic under certain conditions and permit the gas pressure to exceed one atmosphere. In addition, the small dimensions permit resonance radiation, such as the 254 nm line of atomic mercury, to be extracted efficiently from the discharge volume.

Abstract: A microdischarge lamp formed in a one piece integral substrate, preferably a silicon wafer, via micromachining techniques commonly used in integrated circuit manufacture. The lamp is formed by defining an anode separated from a semiconductor cathode, and then micromachining a hollow cavity penetrating the anode, dielectric and cathode. The hollow cathode is formed in the semiconductor and is filled with a discharge medium and sealed to complete the formation process. The lamp includes a micromachined cavity area for enclosing discharge filler, such as mercury vapor. The one piece substrate includes one or more semiconductor regions which act as electrodes for the lamp. A light transmissive cap seals the cavity area. Selection of particular aperture to length ratios for the cavity area permits the lamp to be operated either as a positive column or hollow cathode discharge. Hollow cathode discharge has been demonstrated at pressures of up to about 200 Torr.

Abstract: A microdischarge lamp formed in a one piece integral substrate, preferably a silicon wafer, via micromachining techniques commonly used in integrated circuit manufacture. The lamp includes a micromachined cavity area for enclosing discharge filler, such as mercury vapor. The one piece substrate includes one or more semiconductor regions which act as electrodes for the lamp. A light transmissive cap seals the cavity area. Selection of particular aperture to length ratios for the cavity area permits the lamp to be operated either as a positive column or hollow cathode discharge. Hollow cathode discharge has been demonstrated at pressures of up to about 200 Torr. The small aperture of the cavity area, of about 1 to 400 micrometers, enable the electrons in the discharge to be ballistic. In addition, the small dimensions permit discharges based upon resonance radiation, such as the 253 nm line of atomic mercury.

Abstract: A submersible thrust producing implement for use in combination with an excavator, the excavator being of the type having a boom and a stick with an attachment end on the stick for attaching the implement, which boom and stick can be extended and retracted to selectively submerge the attachment end to a predetermined location in a body of water, and having a hydraulic power system for actuating the boom, the stick, and the implement.