Abstract: An apparatus for improving the power dissipation of a semiconductor device surface mounted on a printed circuit board having at least a top printed circuit board layer and a bottom printed circuit board layer is provided. The apparatus includes a first pad of metallic material connected to a top surface of the top printed circuit board layer. The semiconductor device is connected to the first pad. A second pad of metallic material is connected a to the top surface of at least one of the top and bottom printed circuit board layers, wherein the second pad is electrically isolated from the semiconductor device. The apparatus also includes at least one thermal via for heat transfer through the printed circuit board layers thermally coupled to the thermal pad. A heat sink is thermally coupled to the at least one thermal via.

Abstract: An apparatus for mounting a printed circuit board within a potted member and enhancing the environmental isolation of the circuit board includes a first rigid tubular member and a second elastomeric tubular member. The elastomeric member is positioned about the rigid member and bonded thereto. The tubular members are inserted through openings in the circuit board to support the circuit board at a preselected height and provide bolt hole openings through the first rigid member for mounting the assembly at a desired location. A potting compound is applied in enveloping relation to the circuit board and elastomeric member while maintaining a clear passage through the bolt hole openings. The potting compound chemically bonds to the elastomeric member virtually eliminating water intrusion at the interface between the elastomeric member and the potting compound.