Patents by Inventor James G. Lance, Jr.

James G. Lance, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving distribution of underfill between a flip chip die and a circuit board
    Patent number: 5647123
    Abstract: A method and apparatus improves a distribution of an underfill material (504) applied between a flip chip die (202) and a circuit board (310) at a flip chip site (302) having a solder mask (308). An aperture (304) is formed (806) in the solder mask (308) by removing a predetermined majority of the solder mask (308) from the circuit board (310) within the flip chip site (302) before mounting the flip chip die (202). Then the flip chip die (202) is mounted (810) to the flip chip site (302). The underfill material (504) is then applied (812, 814, 816) such that the underfill material (504) flows into the aperture (304), thus improving the distribution of the underfill material (504).
    Type: Grant
    Filed: October 16, 1995
    Date of Patent: July 15, 1997
    Assignee: Motorola, Inc.
    Inventors: Jonathon G. Greenwood, James G. Lance, Jr., Robert Kenneth Doot