Abstract: A photonic processor computing engine device can include a photonic integrated circuit including an optical phased array having a plurality of radiating pixels that radiate optical signal beams. Each of the radiating pixels can include an optical antenna and an optical phase modulator. The engine can include an electronic control circuit positioned to receive the optical signal beams transmitted from the radiating pixels. The computing engine can further include an electronic feedback circuit in electrical communication with the focal plane array and the electronic control circuit to process a measured intensity of the optical signal beams received by the focal plane array from the optical phased array and provide a feedback signal to the electronic control circuit based on the measured intensity for recalibrating the optical phase modulators of the plurality of radiating pixels to control the phase of the optical signal beams emitted by the plurality of radiating pixels.

Abstract: A photonic integrated circuit (PIC) is disclosed herein. The PIC can include a substrate, a main optical waveguide supported by the substrate. The main optical waveguide can be in communication with an electromagnetic radiation source, and configured to receive electromagnetic radiation from the electromagnetic radiation source. A first branch optical waveguide can be optically coupled to the main optical waveguide at a first location. An optical phased array (OPA) can include plurality of array elements, each having an optical antenna and an optical phase modulator. At least some array elements within a first subset of the plurality of array elements can be optically coupled to the first branch optical waveguide wherein locations of at least some of the plurality of array elements are aperiodic in one or more directions on the substrate.

Abstract: A device includes a photonic integrated circuit having an optical phased array. The optical phased array includes multiple array elements, where each array element includes (i) an antenna element configured to transmit or receive optical signals and (ii) a phase modulator configured to phase-shift the optical signals transmitted or received by the antenna element. The device also includes multiple digital register in integrated circuit (DRIIC) cells, where each DRIIC cell is associated with one of the array elements. The DRIIC cells are configured to receive digital inputs and to provide outputs to the phase modulators of the associated array elements in order to control the phase-shifts of the optical signals transmitted or received by the antenna elements based on the digital inputs.

Abstract: A device includes a photonic integrated circuit (PIC), which includes an optical phased array. The optical phased array includes multiple array elements, where each array element includes (i) an antenna element configured to transmit or receive optical signals and (ii) a phase modulator configured to modulate the optical signals transmitted or received by the antenna element. The PIC also includes at least one of (i) a source laser configured to generate optical energy, where the antenna elements are configured to transmit the optical signals based on the optical energy, and (ii) a receiver configured to receive and process the optical signals received by the antenna elements.

Abstract: A device includes a photonic integrated circuit (PIC), which includes an optical phased array. The optical phased array includes multiple array elements, where each array element includes (i) an antenna element configured to transmit or receive optical signals and (ii) a phase modulator configured to modulate the optical signals transmitted or received by the antenna element. The PIC also includes at least one of (i) a source laser configured to generate optical energy, where the antenna elements are configured to transmit the optical signals based on the optical energy, and (ii) a receiver configured to receive and process the optical signals received by the antenna elements.

Abstract: A device includes a photonic integrated circuit having an optical phased array. The optical phased array includes multiple array elements, where each array element includes (i) an antenna element configured to transmit or receive optical signals and (ii) a phase modulator configured to phase-shift the optical signals transmitted or received by the antenna element. The device also includes multiple digital register in integrated circuit (DRIIC) cells, where each DRIIC cell is associated with one of the array elements. The DRIIC cells are configured to receive digital inputs and to provide outputs to the phase modulators of the associated array elements in order to control the phase-shifts of the optical signals transmitted or received by the antenna elements based on the digital inputs.

Abstract: In a laser beam X-Y scanning system for use, as for example, in turbid media such as sea water; the laser light reflected from objects is received by an image receiving device or detector such as a photomultiplier tube (PMT). The intensity level of the reflected light is maintained at an intensity level within the dynamic range of the image receiving device by controlling the effective intensity of the laser beam by varying the density of a plurality of series positioned variable neutral density filters positioned between the laser beam generator and the object to be illuminated or the illuminated object and the image receiving device. The light density of each filter is determined by real time environmental conditions and the instantaneous position of the laser light source relative to the object from which the laser light is reflected to the image receiver. The density of each of the plurality of filters is controlled by a computer.

Abstract: A circuit package, or other device, (10) is mounted on a printed circuit board, or other substrate, (14) with an electrically conductive sinuous resistor wire structure 30 therebetween to define a space filled with adhesive. When the adhesive is set the package is held in place. When removal is desired, current is passed through the sinuous wire structure to soften the adhesive to permit removal of the package without damage to the package or the board.