Patents by Inventor James G. Neff
James G. Neff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220085219Abstract: A photovoltaic device may include a flexible diode circuit having one or more bypass diodes mounted to one or more semiconductor layers using surface mount technology (SMT). The bypass diode and the one or more of the semiconductor layers may allow the flexible diode circuit to be manufactured as a thin, flexible ribbon, thereby providing efficiency in manufacturing and storing of the flexible diode circuit and/or the photovoltaic device, and also increasing a packing factor and areal power of the photovoltaic device, as compared to a typical photovoltaic device.Type: ApplicationFiled: September 14, 2021Publication date: March 17, 2022Inventors: James G. NEFF, Paul E. SIMS
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Publication number: 20210408317Abstract: An indoor light energy harvesting meter is described that includes a solar module including at least one photovoltaic cell to capture ambient light energy; and a circuit module coupled to the solar module. The circuit module may include a power management circuit configured to convert the ambient light energy captured by the solar module into electric energy; and a micro-controller configured to control the power management circuit and to receive the electric energy from the power management circuit to monitor an amount of indoor harvestable power. The micro-controller may monitor the amount of indoor harvestable power and generate parameters including one or more of an accumulated harvestable power, an instantaneous harvestable power, or a peak instantaneous harvestable power. The indoor light energy harvesting meter may include a display coupled to the micro-controller and configured to display one or more parameters associated with the amount of indoor harvestable power.Type: ApplicationFiled: July 30, 2019Publication date: December 30, 2021Inventor: James G. NEFF
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Publication number: 20190189838Abstract: A device comprises a window layer and a light-directing structure comprising a porous semiconductor layer formed in an n-type region. The device comprises a semiconductor structure, disposed between the window layer and the light-directing structure, comprising a light emitting layer. An opening is formed in the semiconductor structure. A first metal layer is in direct contact with the light-directing structure. A dielectric layer is disposed over the first metal layer and in the opening. A second metal layer is disposed over the dielectric layer. A transparent conductive oxide is disposed between the p-type region and the window layer and in direct contact with the p-type region. A first hole is formed in the dielectric layer, wherein the first hole exposes the transparent conductive oxide such that the second metal layer is in direct contact with the transparent conductive oxide through the first hole.Type: ApplicationFiled: December 3, 2018Publication date: June 20, 2019Applicant: LUMILEDS LLCInventors: John Epler, James G. Neff, Oleg B. Shchekin
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Patent number: 10147843Abstract: A device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region. The semiconductor structure is disposed between a window layer and a light-directing structure. The light-directing structure is configured to direct light toward the window layer; examples of suitable light-directing structures include a porous semiconductor layer and a photonic crystal. An n-contact is electrically connected to the n-type region and a p-contact is electrically connected to the p-type region. The p-contact is disposed in an opening formed in the semiconductor structure.Type: GrantFiled: July 24, 2008Date of Patent: December 4, 2018Assignee: LUMILEDS LLCInventors: John Epler, James G. Neff, Oleg B. Shchekin
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Patent number: 9076944Abstract: A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: GrantFiled: May 14, 2012Date of Patent: July 7, 2015Assignee: Koninklijke Philips Electronics N.V.Inventors: James G. Neff, John E. Epler, Stefano Schiaffino
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Patent number: 8987771Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.Type: GrantFiled: November 6, 2012Date of Patent: March 24, 2015Assignees: Koninklijke Philips N.V., Philips Lumileds Lighting Company, LLCInventors: Serge J. Bierhuizen, James G. Neff
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Publication number: 20130062651Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.Type: ApplicationFiled: November 6, 2012Publication date: March 14, 2013Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: SERGE J. BIERHUIZEN, JAMES G. NEFF
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Patent number: 8319247Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.Type: GrantFiled: March 25, 2010Date of Patent: November 27, 2012Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company LLCInventors: Serge J. Bierhuizen, James G. Neff
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Publication number: 20120225505Abstract: A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: ApplicationFiled: May 14, 2012Publication date: September 6, 2012Applicants: PHILIPS LUMILEDS LIGHTING COMPANY, LLC, KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: James G. Neff, John E. Epler, Stefano Schiaffino
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Patent number: 8236582Abstract: Light emitting diode (LED) structures are fabricated in wafer scale by mounting singulated LED dies on a carrier wafer or a stretch film, separating the LED dies to create spaces between the LED dies, applying a reflective coating over the LED dies and in the spaces between the LED dies, and separating or breaking the reflective coating in the spaces between the LED dies such that some reflective coating remains on the lateral sides of the LED die. Portions of the reflective coating on the lateral sides of the LED dies may help to control edge emission.Type: GrantFiled: October 12, 2009Date of Patent: August 7, 2012Assignees: Philips Lumileds Lighting Company, LLC, Koninklijke Philips Electronics N.V.Inventors: James G. Neff, Serge J. Bierhuizen, John E. Epler
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Patent number: 8202741Abstract: A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: GrantFiled: March 4, 2009Date of Patent: June 19, 2012Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: James G. Neff, John E. Epler, Stefano Schiaffino
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Patent number: 8053905Abstract: A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, a metal p-contact disposed on the p-type region, and a metal n-contact disposed on the n-type region. The metal p-contact and the metal n-contact are both formed on the same side of the semiconductor structure. The light emitting device is connected to a mount by a bonding structure. The bonding structure includes a plurality of metal regions separated by gaps and a metal structure disposed between the light emitting device and the mount proximate to an edge of the light emitting device. The metal structure is configured such that during bonding, the metal structure forms a continuous seal between the light emitting device and the mount.Type: GrantFiled: October 5, 2010Date of Patent: November 8, 2011Assignee: Koninklijke Philips Electronics N.V.Inventors: John E. Epler, Michael R. Krames, James G. Neff, Stefano Schiaffino
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Publication number: 20110233580Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.Type: ApplicationFiled: March 25, 2010Publication date: September 29, 2011Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Serge J. BIERHUIZEN, James G. NEFF
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Patent number: 7989824Abstract: A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is formed. A first metal contact is formed on a portion of the n-type region and a second metal contact is formed on a portion of the p-type region. The first and second metal contacts are formed on a same side of the semiconductor structure. A dielectric material is disposed between the first and second metal contacts. The dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact.Type: GrantFiled: April 23, 2010Date of Patent: August 2, 2011Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: Rafael I. Aldaz, James G. Neff
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Publication number: 20110114987Abstract: A light emitting device includes a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region, a metal p-contact disposed on the p-type region, and a metal n-contact disposed on the n-type region. The metal p-contact and the metal n-contact are both formed on the same side of the semiconductor structure. The light emitting device is connected to a mount by a bonding structure. The bonding structure includes a plurality of metal regions separated by gaps and a metal structure disposed between the light emitting device and the mount proximate to an edge of the light emitting device. The metal structure is configured such that during bonding, the metal structure forms a continuous seal between the light emitting device and the mount.Type: ApplicationFiled: October 5, 2010Publication date: May 19, 2011Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: John E. Epler, Michael R. Krames, James G. Neff, Stefano Schiaffino
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Patent number: 7875984Abstract: A compliant bonding structure is disposed between a semiconductor light emitting device and a mount. When the semiconductor light emitting device is attached to the mount, for example by providing pressure, heat, and/or ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: GrantFiled: March 4, 2009Date of Patent: January 25, 2011Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: John E. Epler, Michael R. Krames, James G. Neff
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Publication number: 20100308367Abstract: A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is formed. A first metal contact is formed on a portion of the n-type region and a second metal contact is formed on a portion of the p-type region. The first and second metal contacts are formed on a same side of the semiconductor structure. A dielectric material is disposed between the first and second metal contacts. The dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact.Type: ApplicationFiled: April 23, 2010Publication date: December 9, 2010Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Rafael I. ALDAZ, James G. NEFF
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Publication number: 20100279437Abstract: Light emitting diode (LED) structures are fabricated in wafer scale by mounting singulated LED dies on a carrier wafer or a stretch film, separating the LED dies to create spaces between the LED dies, applying a reflective coating over the LED dies and in the spaces between the LED dies, and separating or breaking the reflective coating in the spaces between the LED dies such that some reflective coating remains on the lateral sides of the LED die. Portions of the reflective coating on the lateral sides of the LED dies may help to control edge emission.Type: ApplicationFiled: May 1, 2009Publication date: November 4, 2010Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: James G. Neff, Serge J. Bierhuizen
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Publication number: 20100224902Abstract: A compliant bonding structure is disposed between a semiconductor light emitting device and a mount. When the semiconductor light emitting device is attached to the mount, for example by providing pressure, heat, and/or ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: ApplicationFiled: March 4, 2009Publication date: September 9, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: John E. Epler, Michael R. Krames, James G. Neff
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Publication number: 20100227421Abstract: A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.Type: ApplicationFiled: March 4, 2009Publication date: September 9, 2010Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.Inventors: James G. Neff, John E. Epler, Stefano Schiaffino