Abstract: A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.

Abstract: A method to manufacture optoelectronic modules comprises a step of providing a first wafer comprising a plurality of first module portions, wherein each of the first module portions comprises at least one passive optical component, providing a second wafer comprising a plurality of second module portions, wherein each of the second module portions comprises at least one optoelectronic component. The wafers are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules respectively comprising one of the first and the second and the third module portions.

Abstract: A fiber assembly having at least one photonic band-gap fiber and opto-electronic devices coupled to the at least one fiber at either end. The opto-electronic devices serve as electrical-to-optical (EO) and optical-to-electrical (OE) converters and provide industry-standard electrical interfaces to respective electronic devices. The photonic band-gap fiber has a hollow core so that light travels through air rather than glass, thereby providing a number of advantages over glass-based optical fiber assemblies used to connect electronic devices. A bent optical fiber coupler for use in the fiber assembly is also disclosed.