Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A carrier apparatus including a base including a plurality of peripheral portions, each peripheral portion including an inner surface facing an inner direction, at least one peripheral portion selectively moveable between an extended position and a retracted position, and an elastic member to bias the at least one peripheral portion into the retracted position such that the inner surfaces of the peripheral portions of the plurality of peripheral portions cooperate to circumscribe a retaining area. The carrier apparatus may include an article disposed in the retaining area. A fixture including a cavity for receiving the carrier apparatus may be provided. Methods of using, processing, and assembling the carrier apparatus may also be provided.

Abstract: According to some embodiments method for making an optical fiber preform comprises the steps of: (i) placing a plurality of rods with an outer surface having a coefficient of friction 0.02?COF?0.3 into an inner cavity of an apparatus; (ii) placing particulate glass material in the inner cavity between the rods and an inner wall of the mold cavity; and (iii) applying pressure against the particulate glass material to press the particulate glass material against the plurality of rods.

Abstract: A carrier apparatus including a base including an outer peripheral surface and an inner support surface, a frame to connect to the outer peripheral surface of the base, and a circumferential flange including an outer circumferential portion and an inner circumferential portion. The outer circumferential portion to be clamped between the frame and the outer peripheral surface of the base, and the inner circumferential portion to extend inward from the frame. The inner circumferential portion including an opening to be spaced a distance from the inner support surface of the base. The carrier apparatus may include an article including a first major surface, a second major surface, a thickness between the first major surface and the second major surface, and an edge extending across the thickness between the first major surface and the second major surface. Methods of processing and assembling the carrier apparatus may also be provided.

Abstract: A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m2 after the bonding step.

Abstract: An electrostatic chuck apparatus for chucking glass includes a substantially rigid chassis with a plurality of apertures extending from one side of the chassis to another side of the chassis. A plurality of electrostatic chuck pins extend through the openings and are resiliently mounted to the chassis such that the extent to which the electrostatic chuck pins extend through the chassis is individually variable. With this construction, the electrostatic chuck pins maintaining contact with the surface of the glass despite the presence of some variation in the localized surface flatness of the glass.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: A chucking apparatus and method for vacuum processing mobile device cover substrates in a vacuum chamber in which the chucking apparatus is configured for temporarily securing the cover substrate within the vacuum chamber, and includes a carrier substrate with a CTE within 20% of CTE of the cover substrate to prevent the carrier substrate and the cover substrate from becoming detached from one another due to differing rates of thermal expansion during processing in the vacuum chamber. The carrier substrate has a surface contact area in contact with the cover substrate selected to provide for continuous bonding during the processing in the vacuum chamber and to provide for de-bonding after the process in the vacuum chamber is complete. Further, the carrier substrate is prepared for use with a cleaning process that facilitates Van der Waals bonding between the carrier substrate and the cover substrate.

Abstract: A electrostatic chucking apparatus and method for coating mobile device 2D or 3D cover glass in a vacuum coating chamber having a rotating drum and which is driven in rotation. The apparatus includes a carrier including a liquid-cooled cold plate which is removably mountable to the rotating drum. In the case of 3D cover glass, the carrier includes a portion with a 3D profile to match a 3D profile of the 3D cover glass. The carrier further includes an electrostatic chuck (ESC) adapted to secure the cover glass in place against the carrier in the face of centrifugal forces caused by rotation of the rotating drum, with the ESC developing a sufficient clamping force for reliably securing the cover glass in place.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: Substrate holders having support plates for mounting of substrates are disclosed. The substrate holders use a combination of spring clamping elements and pins to grip the substrates. The substrate edge contact height of the spring clamping elements and pins may be selected such that upper portions of the side edges of the substrates are substantially unobstructed, allowing coating to be applied to upper surfaces and upper portions of the side edges of the substrates contemporaneously.

Abstract: An electrostatic chucking apparatus includes a movable member arranged for movement relative to an axial axis, at least one electrostatic chuck coupled to the movable member, and a stationary member. At least one moving insulated electrode is coupled to the movable member, and at least one stationary insulated electrode is coupled to the stationary member in an axial position corresponding to the at least one moving insulated electrode. A slip ring contact couples electrical energy from the at least one stationary insulated electrode to the at least one moving insulated electrode.

Abstract: A chucking apparatus and methods for coating a glass substrate using a vacuum deposition process are disclosed. In one or more embodiments, the chucking apparatus includes an ESC (ESC), a carrier disposed on the ESC, wherein the carrier comprises a first surface adjacent to the ESC and an opposing second surface for forming a Van der Waals bond with a third surface of a glass substrate, without application of a mechanical force on a fourth surface of the glass substrate opposing the third surface. In one or more embodiments, the method includes disposing a carrier and a glass substrate on an ESC, such that the carrier is between the glass substrate and the ESC to form a chucking assembly, forming a Van der Waals bond between the carrier and the glass substrate, and vacuum depositing a coating on the glass substrate.

Abstract: According to some embodiments method for making an optical fiber preform comprises the steps of: (i) placing a plurality of rods with an outer surface having a coefficient of friction 0.02?COF?0.3 into an inner cavity of an apparatus; (ii) placing particulate glass material in the inner cavity between the rods and an inner wall of the mold cavity; and (iii) applying pressure against the particulate glass material to press the particulate glass material against the plurality of rods.

Abstract: The disclosure relates, in various embodiments, to methods for forming activated carbon comprising (a) providing a feedstock mixture comprising a carbon feedstock, at least one activating agent chosen from alkali metal hydroxides, and at least one additive chosen from fats, oils, fatty acids, fatty acid esters, and polyhydroxylated compounds to form a feedstock mixture; (b) optionally heating the feedstock mixture to a first temperature, and when a step of heating the feedstock mixture to a first temperature is performed, optionally holding the feedstock mixture at the first temperature for a time sufficient to react the at least one activating agent with the at least one additive; (c) optionally milling and/or grinding the feedstock mixture; (d) heating the feedstock mixture to an activation temperature; and (e) holding the feedstock mixture at the activation temperature for a time sufficient to form activated carbon.

Abstract: The disclosure relates to methods and apparatuses for forming activated carbon from feedstock particles comprising a carbon feedstock and at least one activating agent. The feedstock particles are contacted with a plasma plume generated by the combination of RF and DC power sources. The feedstock particles may flow in a cyclonic pattern in the plasma plume for increased residence time. The carbon feedstock may be a carbon precursor material or a carbonized material. The feedstock particles are contacted with the plasma plume at a temperature and for a time sufficient to carbonize and/or activate the feedstock particles.

Abstract: The disclosure relates to methods for forming activated carbon comprising providing a feedstock mixture comprising a carbon feedstock and at least one chemical activating agent, heating the feedstock mixture to at least the fluxing temperature of the feedstock mixture to form a feedstock melt, atomizing the feedstock melt and introducing the atomized feedstock mixture into a reactor, rapidly heating the atomized feedstock to at least the solidification temperature by introducing a hot stream into the reactor, introducing the heated feedstock mixture into a reaction vessel, and holding the heated feedstock mixture in the reaction vessel at a temperature and for a time sufficient to react the carbon feedstock with the at least one chemical activating agent to form activated carbon, wherein rapidly heating the atomized feedstock comprises heating the mixture within a time period sufficient to maintain the feedstock mixture in a substantially solid state throughout the rapid heating stage.

Abstract: The disclosure relates to methods for forming activated carbon comprising providing a feedstock mixture comprising a carbon feedstock and at least one chemical activating agent, heating the feedstock mixture to at least the fluxing temperature of the feedstock mixture to form a feedstock melt, atomizing the feedstock melt and introducing the atomized feedstock mixture into a reactor, rapidly heating the atomized feedstock to at least the solidification temperature by introducing a hot stream into the reactor, introducing the heated feedstock mixture into a reaction vessel, and holding the heated feedstock mixture in the reaction vessel at a temperature and for a time sufficient to react the carbon feedstock with the at least one chemical activating agent to form activated carbon, wherein rapidly heating the atomized feedstock comprises heating the mixture within a time period sufficient to maintain the feedstock mixture in a substantially solid state throughout the rapid heating stage.

Abstract: Disclosed are synthetic silica glass body with a birefringence pattern having low fast axis direction randomness factor and glass reflow process. The glass reflow process comprises steps of: providing a glass tube having a notch; and thermally reflowing the glass tube to form a glass plate. The process can be advantageously used to produce fused silica glass plate without observable striae when viewed in the direction of optical axis. Also disclosed are optical members comprising the fused silica glass body and a process for reflowing glass cylinders.