Abstract: An electrosynthetic cell and its use are disclosed. The electrosynthetic cell can be used in a reductive electrosynthesis of one or more desired chemical products from one or more chemical reactants. The electrosynthetic cell comprises a hydrogen anode half-cell and a cathode half-cell. The hydrogen anode half-cell comprises hydrogen (H2), a first liquid phase solution that is in contact with an anode and a heterogeneous redox catalyst capable of catalyzing the oxidation of H2 to H+, and a redox mediator capable of transferring or accepting electrons and/or protons while undergoing reduction or oxidation. The cathode half-cell comprises a second liquid phase solution comprising the one or more chemical reactants that is in contact with a cathode and a reductive synthesis catalyst capable of catalyzing the reductive synthesis of the one or more desired chemical products from the one or more chemical reactants.

Abstract: Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.

Abstract: A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

Abstract: Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.

Abstract: In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.