Abstract: Described herein are apparatuses for holding a substrate in a near vertical position, wherein the design minimizes substrate sag while allowing the substrate to expand and contract under varying thermal conditions. The apparatus minimizes the stress on the substrate, preventing breakage of or damage to the substrate while it undergoes coating and other thermal processes.

Abstract: Described herein are apparatuses and methods for holding a substrate in a position that minimizes particle contamination of the substrate when the substrate is being coated. Along with the apparatus, processes for reducing particle reduction on substrates are provided. The articles and processes described herein are useful in making coated glass substrates, such as used in electrochromic, photochromic, or photovoltaic technologies.

Abstract: A window pane includes a transmission control layer including a first glass sheet, a second glass sheet, and a liquid crystal material disposed between the first glass sheet and the second glass sheet. Each of the first glass sheet and the second glass sheet has a thickness of about 1 mm or less. A first panel is bonded to the first glass sheet of the transmission control layer. A second panel is bonded to the second glass sheet of the transmission control layer. The transmission control layer is disposed between the first panel and the second panel. The liquid crystal material is controllable to adjust a transmittance of the window pane.

Abstract: The principles and embodiments of the present disclosure relate generally to complexly curved glass articles and methods of cold forming complexly curved glass articles, such as complexly curved glass articles having a first bend region with a set of first bend line segments, and a second bend region with a set of second bend line segments, wherein the first bend line segments and the second bend line segments are independent, are not parallel, and do not intersect.

Abstract: Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising differentially heating the laminate structures during lamination or differentially cooling the laminate structures after lamination. Also disclosed herein are methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting at least one substrate in the laminate structure to asymmetric tempering or annealing prior to lamination. Further disclosed herein are laminate structures made according to such methods.

Abstract: Disclosed herein are lenses comprising a first surface, a second convex surface, and a central region disposed therebetween, wherein the central region comprises at least one negative axicon. Also disclosed herein are optical assemblies comprising at least one lens optically coupled to at least one light emitting device.

Abstract: A glass laminate structure comprising an external glass sheet and an internal glass sheet wherein one or both of the glass sheets comprises SiO2+B2O3+Al2O3?86.5 mol. %. and R2O—RO—Al2O3<about 5 mol. %. Exemplary glass sheet can comprise between about 69-80 mol. % SiO2, between about 6-12 mol. % Al2O3, between about 2-10 mol. % B2O3, between about 0-5 mol. % ZrO2, Li2O, MgO, ZnO and P2O5, between about 6-15 mol. % Na2O, between about 0-3 mol. % K2O and CaO, and between about 0-2 mol. % SnO2 to provide a mechanically robust and environmentally durable structure.

Abstract: Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.

Abstract: Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising differentially heating the laminate structures during lamination or differentially cooling the laminate structures after lamination. Also disclosed herein are methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting at least one substrate in the laminate structure to asymmetric tempering or annealing prior to lamination. Further disclosed herein are laminate structures made according to such methods.

Abstract: Embodiments are directed to glass-ceramic substrates with a III-V semiconductor layer, for example, a GaN layer that can be used in LED lighting devices. The glass-ceramics material is in the anorthite-rutile (CaAl2Si2O8+TiO2) family or in the cordierite-enstatite (SiO2—Al2O3—MgO—TiO2) family.

Abstract: A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m.

Abstract: A method of providing locally annealed regions for a glass article. The method includes providing a strengthened glass article having a first surface compressive stress and a first depth of layer of compressive stress, annealing the strengthened glass article to achieve a second surface compressive stress and a second depth of layer of compressive stress, and masking a portion of the glass article during the annealing step to achieve a third surface compressive stress and a third depth of layer of compressive stress in the masked portion. The glass article can be a laminate structure comprising a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The glass layers can include differing surface compressive stresses depths of layer of compressive stress.

Abstract: A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m.

Abstract: Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting the laminate structures to at least one thermal cycle comprising cooling the laminate structures to a first temperature near or below room temperature and heating the laminate structures to a second temperature near or below the lamination temperature. Also disclosed herein are laminate structures made according to such methods.

Abstract: A glass laminate structure comprising an external glass sheet and an internal glass sheet wherein one or both of the glass sheets comprises SiO2+B2O3+Al2O3?86.5 mol. %. and R2O—RO—Al2O3< about 5 mol. %. Exemplary glass sheet can comprise between about 69-80 mol. % SiO2, between about 6-12 mol. % Al2O3, between about 2-10 mol. % B2O3, between about 0-5 mol. % ZrO2, Li2O, MgO, ZnO and P2O5, between about 6-15 mol. % Na2O, between about 0-3 mol. % K2O and CaO, and between about 0-2 mol. % SnO2 to provide a mechanically robust and environmentally durable structure.

Abstract: Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding material is formed from one of glass frit material, ceramic frit material, glass ceramic frit material, and metal paste, which has been melted and cured.

Abstract: Methods and apparatus provide for performing an ion exchange process by immersing a glass sheet into a molten salt bath at one or more first temperatures for a first period of time such that ions within the glass sheet proximate to a surface thereof are exchanged for larger ions from the molten salt bath, thereby producing: (i) an initial compressive stress (iCS) at the surface of the glass sheet, (ii) an initial depth of compressive layer (iDOL) into the glass sheet, and (iii) an initial central tension (iCT) within the glass sheet; and annealing the glass sheet, after the ion exchange process has been completed, by elevating the glass sheet to one or more second temperatures for a second period of time such that at least one of the initial compressive stress (iCS), the initial depth of compressive layer (iDOL), and the initial central tension (iCT) are modified.

Abstract: A laminate structure having a first glass layer, a second glass layer, and at least one polymer interlayer intermediate the first and second glass layers. The first glass layer is comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m. The second glass layer can also be comprised of a thin, chemically strengthened glass having a surface compressive stress of between about 250 MPa and about 350 MPa and a depth of layer (DOL) of compressive stress greater than about 60 ?m.

Abstract: Embodiments are directed to glass-ceramic substrates with a III-V semiconductor layer, for example, a GaN layer that can be used in LED lighting devices. The glass-ceramics material is in the anorthite-rutile (CaAl2Si2O8+TiO2) family or in the cordierite-enstatite (SiO2—Al2O3—MgO—TiO2) family.

Abstract: Methods and apparatus provide for forming a semiconductor-on-insulator (SOI) structure, including subjecting a implantation surface of a donor semiconductor wafer to an ion implantation step to create a weakened slice in cross-section defining an exfoliation layer of the donor semiconductor wafer; and subjecting the donor semiconductor wafer to a spatial variation step, either before, during or after the ion implantation step, such that at least one parameter of the weakened slice varies spatially across the weakened slice in at least one of X- and Y- axial directions.