Abstract: A curable adhesive composition comprising (i) a sulfur-bearing component selected from chlorosulfonated polyethylene and a mixture of a sulfonylchloride with chlorinated polyethylene, said sulfur-bearing component containing about 25 to 70 weight percent of chlorine and about 3 to 160 mmoles of sulfonyl chloride moiety per 100 g of chlorosulfonated or chlorinated polyethylene, said chlorosulfonated or chlorinated polyethylene being made from polyethylene having a melt index of about 4 to 500, (ii) at least one polymerizable vinyl monomer, and (iii) at least one member of the group of conductive particles selected from silver, carbon and titanium carbide in an amount which will produce an electrically conductive adhesive composition when cured; also disclosed are polymerization catalysts for the curable adhesive.