Abstract: A diaphragm test probe for establishing a detachable electrical connection to the pads on an integrated circuit chip. Leads are electrically connected to a plurality of conductive contacts which are affixed to a flexible diaphragm. The conductive contacts are arranged to match the pattern of the pads on the integrated circuit chip and are aligned with these pads using visual sighting. After alignment, fluidic pressure is applied to the flexible diaphragm, causing it to flex and, in turn, the conductive contacts to make electrical contact with the pads on the integrated circuit. A plurality of sets of conductive contacts may be affixed to a single flexible diaphragm so as to allow multiple chip testing without realignment of the test probe.