Patents by Inventor James H. Covell
James H. Covell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7989229Abstract: Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current electrode sensor array or a capacitive sensor array. The sensor is configured to convert local stress resulting from contact with the surface into light intensity and/or modulation in local current density. Both the light intensity and current density are linearly proportional to the local stress. The image stress provided by the sensor can then be captured by focusing the light intensity onto a suitable detector to provide a topographical image of the surface. Current density can alternatively be directly sensed via high resolution electrode array.Type: GrantFiled: September 10, 2007Date of Patent: August 2, 2011Assignee: International Business Machines CorporationInventor: James H. Covell
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Patent number: 7806312Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.Type: GrantFiled: October 23, 2006Date of Patent: October 5, 2010Assignee: International Business Machines CorporationInventors: Lannie R. Bolde, James H. Covell, Mark W. Kapfhammer
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Publication number: 20090068770Abstract: Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current electrode sensor array or a capacitive sensor array. The sensor is configured to convert local stress resulting from contact with the surface into light intensity and/or modulation in local current density. Both the light intensity and current density are linearly proportional to the local stress. The image stress provided by the sensor can then be captured by focusing the light intensity onto a suitable detector to provide a topographical image of the surface. Current density can alternatively be directly sensed via high resolution electrode array.Type: ApplicationFiled: September 10, 2007Publication date: March 12, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: James H. Covell
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Patent number: 7168609Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.Type: GrantFiled: September 3, 2002Date of Patent: January 30, 2007Assignee: International Business Machines CorporationInventors: Lannie R Bolde, James H Covell, Mark W. Kapfhammer
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Patent number: 6964885Abstract: An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.Type: GrantFiled: January 6, 2004Date of Patent: November 15, 2005Assignee: International Business Machines CorporationInventors: Patrick Anthony Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar Kamath, Kenneth Charles Marston, Frank Louis Pompeo, Karl J. Puttlitz, Jeffrey Allen Zitz
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Publication number: 20040141296Abstract: An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.Type: ApplicationFiled: January 6, 2004Publication date: July 22, 2004Inventors: Patrick Anthony Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldmann, Ronald L. Hering, Sundar M. Kamath, Kenneth Charles Marston, Frank Louis Pompeo, Karl J. Puttlitz, Jeffrey Allen Zitz
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Patent number: 6703560Abstract: An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.Type: GrantFiled: April 19, 2001Date of Patent: March 9, 2004Assignee: International Business Machines CorporationInventors: Patrick Anthony Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath, Kenneth Charles Marston, Frank Louis Pompeo, Karl J. Puttlitz, Jeffrey Allen Zitz
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Publication number: 20040041011Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.Type: ApplicationFiled: September 3, 2002Publication date: March 4, 2004Applicant: International Business Machines CorporationInventors: Lannie R. Bolde, James H. Covell, Mark W. Kapfhammer
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Publication number: 20020050398Abstract: An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.Type: ApplicationFiled: April 19, 2001Publication date: May 2, 2002Inventors: Patrick Anthony Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldmann, Ronald L. Hering, Sundar M. Kamath, Kenneth Charles Marston, Frank Louis Pompeo, Karl J. Puttlitz, Jeffrey Allen Zitz
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Publication number: 20020023945Abstract: A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column.Type: ApplicationFiled: May 22, 2001Publication date: February 28, 2002Applicant: International Business Machines CorporationInventors: Peter A. Gruber, Lannie R. Bolde, Guy P. Brouillette, James H. Covell, David Danovitch, Chon C. Lei
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Patent number: 6333209Abstract: A one step method for curing encapsulant and joining Ball Grid Array (BGA) solder balls comprises curing an encapsulant material simultaneously with the joining of the eutectic material of the apparatus whether that eutectic material is a solder paste or preform, the balls being of a higher melt material or the balls themselves being an eutectic material. The method performs both functions in one pass through a furnace avoiding the separate and time consuming encapsulant and/or underfill curing step.Type: GrantFiled: April 29, 1999Date of Patent: December 25, 2001Assignee: International Business Machines CorporationInventors: Patrick A. Coico, James H. Covell, Lewis S. Goldmann, Kimberly A. Kelly
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Patent number: 6276596Abstract: A method for joining a multiplicity of multi-alloy solder columns to an electronic substrate and the structure formed by such method are disclosed. In the method, a mold plate equipped with a multiplicity of cavities is first filled by an injection molded solder technique with a high temperature solder forming a multiplicity of solder columns. The mold plate is then sandwiched between an extraction plate and a transfer plate by utilizing a multiplicity of displacement means equipped in the extraction plate to displace the multiplicity of solder columns from the mold plate into a multiplicity of apertures equipped in the transfer plate. The multiplicity of cavities in the transfer plate each has a straight opening and a flared opening. The flared opening is then filled with a low temperature solder paste to encapsulate one end of the high temperature solder column.Type: GrantFiled: August 28, 2000Date of Patent: August 21, 2001Assignee: International Business Machines CorporationInventors: Peter A. Gruber, Lannie R. Bolde, Guy P. Brouillette, James H. Covell, David Danovitch, Chon C. Lei
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Patent number: 6278193Abstract: A method and structure for manufacturing semiconductor devices comprising providing a chip and a substrate, aligning the chip and the substrate, attaching the chip to the substrate and optionally verifying chip/substrate alignment, the aligning comprising providing at least one chip alignment mark on a first side of the chip (wherein the chip alignment mark corresponds to chip pads on a second side of the chip) and aligning the alignment mark with substrate pads on the substrate.Type: GrantFiled: December 7, 1998Date of Patent: August 21, 2001Assignee: International Business Machines CorporationInventors: Patrick A. Coico, James H. Covell
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Patent number: 6186216Abstract: An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate.Type: GrantFiled: December 10, 1998Date of Patent: February 13, 2001Assignee: International Business Machines CorporationInventors: Lannie R. Bolde, James H. Covell II
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Patent number: 5982038Abstract: The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection.For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.Type: GrantFiled: May 1, 1997Date of Patent: November 9, 1999Assignee: International Business Machines CorporationInventors: Hilton T. Toy, Lannie R. Bolde, James H. Covell, II, David L. Edwards, Lewis S. Goldmann, Peter A. Gruber
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Patent number: 5971058Abstract: An apparatus and method are provided for continuously injecting molten solder into a plurality of molds for transfer of the formed solder mounds to electronic devices such as multilayer ceramic packages. A conventional injection molding apparatus is employed with a specially designed apparatus for forming the molds and preferably with a specially designed mold to provide a continuous molding process. The apparatus is preferably of a U-shaped configuration whereby molds are advanced under the molten solder reservoir and injection head by a preceding mold in the apparatus. The urging action of the preceding mold on the succeeding mold and, preferably in conjunction with the preferred mold design, enables a continuous method and apparatus for injecting molten solder into a plurality of molds.Type: GrantFiled: June 13, 1997Date of Patent: October 26, 1999Assignee: International Business Machines CorporationInventors: Lannie R. Bolde, James H. Covell, II
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Patent number: 5968670Abstract: A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.Type: GrantFiled: August 12, 1997Date of Patent: October 19, 1999Assignee: International Business Machines CorporationInventors: Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, II, Shaji Farooq, Lewis S. Goldmann, Raymond A. Jackson, David C. Linnell, Gregory B. Martin, Frank L. Pompeo, Kathleen A. Stalter, Hilton T. Toy
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Patent number: 5961032Abstract: A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.Type: GrantFiled: June 30, 1997Date of Patent: October 5, 1999Assignee: International Business Machines CorporationInventors: James H. Covell, II, Shaji Farooq, Peter A. Gruber, Sudipta K. Ray
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Patent number: 5821161Abstract: The present invention relates generally to a new scheme of providing a seal for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal is a two layer, solder structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder structure has a thick high melting point temperature region that is attached to a cap, and a thin interconnecting region of lower melting point temperature region for sealing the substrate to the cap.Type: GrantFiled: May 1, 1997Date of Patent: October 13, 1998Assignee: International Business Machines CorporationInventors: James H. Covell, II, Lannie R. Bolde, David L. Edwards, Lewis S. Goldmann, Peter A. Gruber, Hilton T. Toy
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Patent number: 5504612Abstract: An apparatus and method are disclosed for laser raster scanning a substrate in an XY plane wherein a single motor is used to provide synchronized X-Y scanning by two mirrors positioned orthogonally and which move linearly in an XY plane relative to each other by the rotation of the motor shaft. A preferred embodiment uses a specially designed cam to provide back and forth laser scanning motion and an intermittent gear to provide indexing of the laser. The apparatus and method may be configured for various scan speeds, spot sizes, Y-axis indexing and X-axis scan at the object plane. Over scanning of the active XY area of the object plane is preferred to provide constant velocity and energy density over the active XY area.Type: GrantFiled: May 18, 1995Date of Patent: April 2, 1996Assignee: International Business Machines CorporationInventors: Joshua M. Cobb, James H. Covell, II, Franz X. Topolovec, Uldis A. Ziemins