Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.

Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.

Abstract: A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.

Abstract: A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.

Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Abstract: An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.

Abstract: An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.

Abstract: An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.

Abstract: A pressure sensor in accordance with the invention comprises a die having pressure-sensing electrical components formed in a first side of the die. In one embodiment, a method of securing a cap to a silicon die is provided comprising forming a thin glass particle layer on a bonding area of the cap, heating the cap and the thin glass particle layer on the bonding area to form a substantially continuous glass layer on the bonding area, and heating the cap and silicon die to a temperature above the melting point of the glass to form a bond between the cap and the silicon die.

Abstract: A strain-sensing device comprises a metal, glass, ceramic, or plastic cell that has formed within it a diaphragm characterized by a thin layer of material bounded by a thick layer of material. A silicon strain gauge, either junction isolated or dielectric isolated, is attached directly to the diaphragm. The strain gauge has at least one sensing element that is aligned such that applied pressure to the diaphragm induces a strain in the sensing element. The silicon strain gauge has a triangular shape that is optimizes the performance and reliability of the sensor with the added benefit of making it more affordable as well.

Abstract: A non-invasive sensor assembly device includes a pedestal mounted sensor die for stress isolation of the sensor die from external stresses, a substrate and die porting configuration to limit exposure of the sensor assembly to only the interior of the sensor die and a connecting tube to provide significant isolation of the sensor assembly and its constituent parts from the fluid stream, and an inert coating conformally deposited on the inside surfaces of the die, pedestal, and connecting tube that are in contact with the fluid media to thereby provide complete isolation of the sensor assembly from the media.