Abstract: A binder formulation is provided including water, a first polymer, and a second polymer. The first polymer is preferred to be a poly(carboxylic acid) and the second polymer is preferred to be a co-polymer containing both carboxylic acid and hydrophobic monomers. The first polymer can be polymers such as poly(acrylic acid), poly(methacrylic acid), poly(maleic acid), or poly(itaconic) acid. The second polymer is preferred to be an alternating copolymer of a monomer of a carboxylic acid and a hydrophobic monomer such as styrene, isobutylene, or n-alkenes. These binder formulations are particularly useful in making granulated powders in powder metallurgy and additive manufacturing.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.

Abstract: The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.