Patents by Inventor James H. Howser

James H. Howser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6238950
    Abstract: A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: May 29, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: James H. Howser, Tom L. Fowler
  • Patent number: 6054764
    Abstract: A multi-component electronic assembly (100) including a leadframe (101) having upper and lower surfaces and a plurality of conductive leads (203). Each lead (203) has first bonding surfaces (201) on the upper surface of each lead and second bonding surfaces (201) on the lower surface of each lead (203). Preferably, each lead has a plurality of third bonding surfaces (202) formed on at least some of the plurality of leads where the third bonding surfaces (202) are formed by conductive extensions of the leads (203) that extend towards the center of the assembly (100). A first passive component (102) is electrically and mechanically coupled to the first bonding surfaces. A second passive component (104) is electrically and mechanically coupled to the second bonding surfaces. Where third bonding surfaces (202) are used, a third component (103) is electrically and mechanically coupled to the third bonding surfaces (202).
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: April 25, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: James H. Howser, Tom L. Fowler