Patents by Inventor James H. Lombard

James H. Lombard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stackable test apparatus for protecting integrated circuit packages during testing
    Patent number: 6949817
    Abstract: A stackable test apparatus is disclosed including a body having a first surface with a raised portion extending from the first surface along a perimeter of the body and a plurality of stacking pins extending away from the first surface arraigned in a stacking pin pattern. Also included is a plurality of stacking pin receivers located on a second surface of the body, the stacking pin receivers arraigned in a pattern to match the stacking pin pattern and sized to accept the stacking pin.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: September 27, 2005
    Assignee: Applied Micro Circuits Corporation
    Inventors: James H. Lombard, Timothy Scott Shook
  • Low temperature cofireable dielectric paste
    Patent number: 5801108
    Abstract: A dielectric paste material may be used in the fabrication of multilayered ceramic modules to create circuit elements. The dielectric paste is a multiphase material in which at least one phase is an alkaline earth metal, transition metal silicate. This yields a dielectric paste with extremely good K & Q values suitable for high frequency applications which significantly reduce manufacturing costs of modules.
    Type: Grant
    Filed: September 11, 1996
    Date of Patent: September 1, 1998
    Assignee: Motorola Inc.
    Inventors: Rong-Fong Huang, Carlos A. Sanchez, James H. Lombard
  • High adhesion, solderable, metallization materials
    Patent number: 5431718
    Abstract: A high adhesion strength, co-fireable, solderable silver metallization material for use with low-fire ceramics is provided. The metallization material includes the metallization powder as well as a binder vehicle, and an adhesion promoting agent. The combination of elements allows a metallization material which can be cofired at relatively low temperatures necessary for firing ceramic substrate materials while providing an adequate base for soldering subsequent circuit components to the ceramic substrate.
    Type: Grant
    Filed: July 5, 1994
    Date of Patent: July 11, 1995
    Assignee: Motorola, Inc.
    Inventors: James H. Lombard, Rong F. Huang
  • Palladium thick film resistor containing boron nitride
    Patent number: 5346720
    Abstract: An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium powder and boron nitride powder dispersed in a vaporizable vehicle is applied to a substrate and sintered to form the film. In a preferred embodiment, the substrate is a ceramic powder compact that is concurrently sintered in a co-firing process.
    Type: Grant
    Filed: July 6, 1993
    Date of Patent: September 13, 1994
    Assignee: Motorola, Inc.
    Inventors: James H. Lombard, Leonard J. Anderson
  • Palladium paste and process for forming palladium film onto a ceramic substrate utilizing the paste
    Patent number: 5281389
    Abstract: A palladium paste is utilized for forming a palladium film on a ceramic substrate. The paste includes a sinterable palladium powder dispersed in a vaporizable liquid vehicle. The paste also includes minor additions of titanium dioxide powder and a metal titanate powder. A preferred titanate powder is composed of strontium calcium titanate. It is found that the additions remarkably improve adhesion of the palladium film to the substrate.
    Type: Grant
    Filed: August 3, 1992
    Date of Patent: January 25, 1994
    Assignee: Motorola, Inc.
    Inventors: James H. Lombard, Rong-Fong Huang, Carlos A. Sanchez, Ming-Yih Su
  • Palladium thick film resistor containing boron nitride
    Patent number: 5250358
    Abstract: An electrically resistive film of the type used for forming thick film resistors is formed predominantly of palladium and includes an addition of boron nitride to increase resistance, preferably in combination with tantalum oxide. A paste of palladium powder and boron nitride powder dispersed in a vaporizable vehicle is applied to a substrate and sintered to form the film. In a preferred embodiment, the substrate is a ceramic powder compact that is concurrently sintered in a co-firing process.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: October 5, 1993
    Assignee: Motorola, Inc.
    Inventors: James H. Lombard, Leonard J. Anderson