Patents by Inventor James H. Peterman

James H. Peterman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reducing introduction of foreign material to wafers
    Patent number: 7901490
    Abstract: A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: March 8, 2011
    Assignee: International Business Machines Corporation
    Inventors: David J. Clark, Alison K. Easton, James E. Fluegel, James H. Peterman
  • IC WAPER CARRIER SEALED FROM AMBIENT ATMOSPHERE DURING TRANSPORTATION FROM ONE PROCESS TO THE NEXT
    Publication number: 20100051501
    Abstract: A wafer carrying structure is provided that allows more efficient operation of the opening and closing mechanisms. More specifically, the wafer carrier includes pressure relief structures that provide appropriate pressure equalization during the opening and closing operations of the wafer carrier. This allows doors on the wafer to be more easily opened and closed while also providing significant environmental isolation for the wafers during transport operations. Relief structures specifically designed to remain closed except for those brief periods of time where pressure relief is necessary to equalize pressure during opening and closing of the carrier.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 4, 2010
    Applicant: International Business Machines Corporation
    Inventors: William E. Corbin, JR., Alison K. Easton, James E. Fluegel, Christopher W. Long, James H. Peterman, Laura Mauer
  • REDUCING INTRODUCTION OF FOREIGN MATERIAL TO WAFERS
    Publication number: 20090180848
    Abstract: A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.
    Type: Application
    Filed: January 10, 2008
    Publication date: July 16, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David J. Clark, Alison K. Easton, James E. Fluegel, James H. Peterman