Abstract: An improved integrated circuit package having high density interconnections between die pads and a plurality of coplanar connector tabs on a selected metal layer in the integrated circuit package, wherein the pitch of the connector tabs is a predetermined multiple of the pitch of the die pads.

Abstract: A liquid cooled electronic circuit includes a printed circuit board having two oppositely facing surfaces, electronic components mounted on one of the two surfaces, and conduits which carry a liquid and touch the electronic components to cool them; wherein a frame is also provided for holding the conduits snugly against the components without overstressing the printed circuit board. This frame is characterized as having: (a) a first set of contacts which engage the conduits; (b) a second set of contacts which engage the surface of the printed circuit board opposite the one surface; (c) the contacts of the second set being spaced apart and located at predetermined distances from the board's perimeter; and (d) fasteners for urging the conduits against the electronic components by moving the first and second sets of contacts toward each other with the conduits, the electronic components, and the printed circuit board lying therebetween.