Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: An optoelectronic module is seated onto a substrate connector by guiding the module along an initial path portion that is misaligned with respect to the mating direction defined by the substrate connector and further includes providing a positive pressure drive along an end path portion with sufficient force to secure the optoelectronic module to the substrate connector. Where the mating is via a pin-and-socket arrangement, the positive pressure drive requires sufficient force to push the main body of the module to ensure entry of the pins into the sockets. Typically, there is a conversion from force applied in one direction to module motion in the orthogonal direction. However, a rocking cam embodiment is also described.

Abstract: A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Abstract: A process for improving uniformity across the surface of a substrate during a plasma process such as plasma etching. A conductive plane is formed at the back surface of the substrate. A plasma process is then performed to the front surface of the substrate. The conductive plane may then be removed upon completion of the plasma process and before final processing steps.

Abstract: An exercise and rehabilitation device consisting of a weighted pair of gloves, each glove having a permanently affixed weighted section on the back-hand side of the glove and paired contoured weights which encircle the end of each individual finger and thumb sleeve. The digit sleeves are open ended to expose the individuals fingertips. A hook-and-pile attachment strip on the palm of the glove is operatively associated with a hook-and-pile covered cylindrical weight which can be detachably grasped by the wearer. A weighted wrist support strap detachably secures the glove to the individual's hand.

Abstract: A weighted insole with a pair of flat weights encapsulated inside a flexible material which is formed into an insole for placement in a shoe. A first weight is encapsulated in front, and a second weight is encapsulated behind, the ball-of-the-foot area. The second weight additionally has cutouts at the arch and heel areas of the foot. These unweighted areas throughout their thickness include insole material which provides extra comfort and cushioning where the user typically places more weight on the foot. The front and back weighted construction additionally allows for flexibility of the insole at the ball area. A pattern of nodes is projected from the bottom of the insole to frictionally hold the insole in place in the shoe.

Abstract: A method of producing a non-porous mat includes coating a predominantly glass fiber porous web substrate. The coating comprises an aqueous mixture of a mineral pigment; a first binder material comprised of a polymer latex adhesive material; and, a second binder material comprised of an inorganic adhesive material. On a dry weight basis, the first binder material comprises no more than 5.0% by weight, and the second binder material at least 0.5% by weight, of the total weight of the coating. The second binder preferably comprises an inorganic compound such as calcium oxide, calcium silicate, calcium sulfate, magnesium oxychloride, magnesium oxysulfate, or aluminum hydroxide. In one mode, the second binder is included in the mineral pigment, as in the cases wherein the mineral pigment includes aluminum trihydrate, calcium carbonate, calcium sulfate, magnesium oxide, and some clays and sands. A method of using the coated mat to produce a thermosetting plastic foam laminate panel is also disclosed.

Abstract: A coating composition and method of producing a non-porous mat includes coating a predominantly glass fiber porous web substrate. The coating comprises an aqueous mixture of a mineral pigment; a first binder material comprised of a polymer latex adhesive material; and, a second binder material comprised of asphalt emulsion material. The total dry weight basis of both binders does not exceed 24% of the total coating.

Abstract: Pipe joint connections with set screws that have swivel-mounted feet. Such set screws when used with such connections flexibly and tenaciously retain pipe sections in the connections in the same manner that a toy "chinese puzzle" woven straw tube retains a person's fingers. The larger faces of such set screw feet allow the set screws to grip the pipe section with considerably less torque than that required by conventional set screws. Such connections form a flexible, strong coupling that maintains its holding power despite changes in pipe position and environmental factors such as temperature and pressure. Such connections are particularly well suited for joining polyvinyl chloride pipe sections to mechanical joint pipe fittings, valves and hydrants, although they are also extremely effective in joining conventional mechanical joint metal pipe sections to such attachments.

Abstract: A process for preparing a ureaform type resin fertilizer as an aqueous suspension which is stable and preferably has an Availability Index of at least 70 which, in a preferred embodiment, comprises: adding urea to an acidic solution of formaldehyde having a pH of 0.25 to 1.75 at a rate of addition to keep the temperature below 98.degree. C. until the mole ratio of formaldehyde to urea is from 3.5:1 to 2.6:1; adjusting the pH of the reaction mixture to between about 5.2 and 6.8 and the temperature from about 75.degree. C. to 92.degree. C. and adding urea until a formaldehyde to urea mole ratio of 0.5:1 to 1.8:1 is attained and the nephelometric turbidity of the reaction mixture is in the range of 200 to 800 NTU units; and then neutralizing the reaction mixture to a basic pH not exceeding about 8.5.

Abstract: Urea-formaldehyde precursors are produced in a two-stage process. In the first stage, urea is slowly added to an acidic solution of formaldehyde at a pH of 1.0 or less, at a rate that maintains the temperature at 50.degree. C. but not in excess of 98.degree. C. When an F/U mole ratio of 3.25:1 to 2.5:1 has been attained, the pH is adjusted to the basic side, generally from about 7.2 to about 8.0. In the second stage, additional urea is added to the condensate produced in the first stage, to attain an F/U mole ratio of 3.0:1 to 2.5:1. The condensate and precursor have fertilizer applications. The precursor is useful in urea-formaldehyde resin production.