Abstract: A track shoe for an endless track assembly has a base and an opposing hull. The hull of the track shoe has opposing sidewalls that are angled to meet at an apex, thus forming an inverted V-shape. The apex of the hull extends the width of the track shoe. Laterally-disposed ridges are spaced apart from the apex. and the height of the ridges tapers outwardly from the hull to form, respectively, a leading lip and a trailing lip of the track shoe. The track shoe may have upward bends at the ends of the width of the track shoe and optionally, may have secondary hulls.

Abstract: A track chain link includes a front side and a rear side with a distance therebetween and a base having a width. The base is coupled to an end of the front side and a corresponding end of the rear side. The width of the base is greater than the distance between the front side and the rear side. The base includes at least one extension having a combined length equal to the difference between the width of the base and the distance between the front side and the rear side. The at least one extension may be positioned beyond the front side of the track chain link. A track chain assembly includes the track chain link coupled to a track shoe. At least a portion of the base of the track chain link engages the track shoe.

Abstract: A track shoe for an endless track assembly has a base and an opposing hull. The hull of the track shoe has opposing sidewalls that are angled to meet at an apex, thus forming an inverted V-shape. The apex of the hull extends the width of the track shoe. Laterally-disposed ridges are spaced apart from the apex. and the height of the ridges tapers outwardly from the hull to form, respectively, a leading lip and a trailing lip of the track shoe. The track shoe may have upward bends at the ends of the width of the track shoe and optionally, may have secondary hulls.

Abstract: Systems and methods for automated monitoring of inventory are disclosed. In accordance with some embodiments of the disclosure, automated monitoring is achieved through the use of active tags, such as RFID tags, that are coupled to inventory and tracked by communication nodes. The tags are designed to consume a low amount of power while ensuring robust wireless communication. Indeed, the tags are capable of communicating with remote nodes even when the tags are buried in stacks of inventory items, and the system is scalable to handle a large number of tags.

Abstract: Systems and methods for automated monitoring of inventory are disclosed. In accordance with some embodiments of the disclosure, automated monitoring is achieved through the use of active tags, such as RFID tags, that are coupled to inventory and tracked by communication nodes. The tags are designed to consume a low amount of power while ensuring robust wireless communication. Indeed, the tags are capable of communicating with remote nodes even when the tags are buried in stacks of inventory items, and the system is scalable to handle a large number of tags.

Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.

Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.

Abstract: Cleaning solutions and processes for cleaning semiconductor devices or semiconductor tooling during manufacture thereof generally include contacting the semiconductor devices or semiconductor tooling with an acidic aqueous cleaning solution free of a fluorine containing compound, the acidic aqueous cleaning solution including at least one antioxidant and at least one non-oxidizing acid.

Abstract: The invention is directed to a chemical-mechanical polishing formulation that includes: an abrasive particulate component; iodic acid; and water. The invention is also directed to a method for polishing a metal-containing substrate, the method including the steps of polishing the metal-containing substrate with a polishing pad at a suitable polishing pressure while the metal-containing substrate is in contact with the above polishing formulation.

Abstract: The invention is directed to a chemical-mechanical polishing formulation that includes: an abrasive particulate component; iodic acid; and water. The invention is also directed to a method for polishing a metal-containing substrate, the method including the steps of polishing the metal-containing substrate with a polishing pad at a suitable polishing pressure while the metal-containing substrate is in contact with the above polishing formulation.

Abstract: By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e.g., STI, PMD, ILD) on a substrate, comprises: ceria particles having a concentration of 1.0-5.0 wt % and silica particles having a concentration of 0.1-5.0 wt %. A ratio of ceria concentration to silica concentration (ceria:silica) is from approximately 10:1 to nearly 1:1 by weight. The ceria particles have a particle size of 150-250 nm, and the silica particles have a particle size of greater than 100 nm. The silica may be fumed or colloidal. The slurry has a pH of approximately 9.0.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: Disclosed herein are a system and method of polishing a layer of a substrate. The disclosed method includes providing a polishing apparatus adapted to impart relative movement between a polishing pad and a substrate having a first layer to be polished; providing a liquid medium having a pH between 4 and 11 to an interface between the substrate and the polishing pad, the liquid medium including a pH controlling substance including at least one of an acid and a base, a carbonate and a stabilizer additive comprising at least one selected from the group consisting of amino acids and polyacrylic acid; and moving at least one of the substrate and the polishing pad relative to the other to polish the layer of the substrate.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. Connection to the substrate, e.g., using round solder balls, is much more easily detected, e.g., by x-ray, than when using round pads, especially those having a smaller diameter than the balls.

Abstract: A moulding method utilizing apparatus for forming a monolithic reinforced concrete modular building structure comprising walls and floor with apertures therein for doors, windows and the like. The apparatus comprises separable mould components in the form of a floor, end walls, side walls and a core moveable into cooperation with each other and a wheeled pallet to define a moulding cavity for forming the module, and out of cooperation to leave the formed module free for withdrawal on the pallet from the apparatus. The moulding apparatus is controllably connected to a source of pressurized wet concrete for filling the mould and is enclosed within an autoclave for accelerating the initial curing process of the concrete in the mould by heating.