Abstract: In one example, a workpiece support structure of a plasma treatment chamber has upper and lower ends, and first and second support members that extend between the upper and lower ends. The support members are electrically isolated from one another and offset from one another along a horizontal direction so as to define a cavity therebetween. The first and second support members support electrodes within the cavity such that (1) the electrodes are offset from one another along the vertical direction, (2) the electrodes extend between the first and second support members along the first horizontal direction, (3) a first set of the electrodes are electrically coupled to the first support member and electrically isolated from the second support member, and (4) a second set of the electrodes, different from the first set, are electrically coupled to the second support member and electrically isolated from the first support member.

Abstract: Systems, methods, and apparatuses for workpiece processing with plasma, including thermal isolation of a workpiece holder assembly, are described. An apparatus includes a chamber that at least partially defines a processing space for generating plasma. The apparatus includes a base assembly that at least partially defines a lower end of the chamber and has an inner perimeter that defines an opening in the base assembly. The apparatus further includes a workpiece holder assembly positioned, at least in part, within the opening. The workpiece holder assembly includes heating element(s) and a body with an upper surface configured to receive a workpiece. A gap is defined between the inner perimeter of the base assembly and an outer perimeter of the body. The gap is configured to thermally isolate the base assembly from the body.

Abstract: A substrate carrier is used in an in-line fabrication such as Plasma Enhanced Chemical Vapor Deposition (PECVD) for application of thin film on substrates. The carrier is in thermal communication with the substrate and thereby provides heat sinking. The carrier further permits movement of the substrate past a deposition apparatus at a deposition station.