Patents by Inventor James Hattis

James Hattis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for attenuating and/or terminating RF circuit
    Patent number: 12498395
    Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: December 16, 2025
    Assignee: Xcerra Corporation
    Inventors: Yukang Feng, Nadia Steckler, Jason Mroczkowski, James Hattis
  • Reflective and interference controlled absorptive contactor
    Patent number: 12334988
    Abstract: An apparatus including a contactor having a hole and including a radio frequency absorptive material and a probe inserted in the hole to couple a test signal to a device under test is disclosed. A test system for testing integrated circuits including a contactor including a radio frequency absorptive material is disclosed. A method for making the contactor is also disclosed.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: June 17, 2025
    Assignee: Xcerra Corporation
    Inventors: Yukang Feng, Jason Mroczkowski, Nadia Steckler, Aaren Lonks, Martin Cavegn, James Hattis, Michael Hanks
  • Dielectric resonating test contactor and method
    Patent number: 12123897
    Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: October 22, 2024
    Assignee: Xcerra Corporation
    Inventors: James Hattis, Travis Evans, Waqas Muzammil, Yukang Feng, Jason Mroczkowski, Marty Cavegn
  • SYSTEM AND METHOD FOR ATTENUATING AND/OR TERMINATING RF CIRCUIT
    Publication number: 20230243869
    Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: XCERRA CORPORATION
    Inventors: Yukang FENG, Nadia STECKLER, Jason MROCZKOWSKI, James HATTIS
  • System and method for attenuating and/or terminating RF circuit
    Patent number: 11650227
    Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: May 16, 2023
    Assignee: XCERRA CORPORATION
    Inventors: Yukang Feng, Nadia Steckler, Jason Mroczkowski, James Hattis
  • REFLECTIVE AND INTERFERENCE CONTROLLED ABSORPTIVE CONTACTOR
    Publication number: 20230024755
    Abstract: An apparatus including a contactor having a hole and including a radio frequency absorptive material and a probe inserted in the hole to couple a test signal to a device under test is disclosed. A test system for testing integrated circuits including a contactor including a radio frequency absorptive material is disclosed. A method for making the contactor is also disclosed.
    Type: Application
    Filed: July 23, 2021
    Publication date: January 26, 2023
    Inventors: Yukang Feng, Jason Mroczkowski, Nadia Steckler, Aaren Lonks, Marty Cavegn, James Hattis, Mike Hanks
  • SYSTEM AND METHOD FOR ATTENUATING AND/OR TERMINATING RF CIRCUIT
    Publication number: 20210223285
    Abstract: A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
    Type: Application
    Filed: January 6, 2021
    Publication date: July 22, 2021
    Inventors: Yukang Feng, Nadia Steckler, Jason Mroczkowski, James Hattis
  • DIELECTRIC RESONATING TEST CONTACTOR AND METHOD
    Publication number: 20210190821
    Abstract: A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 24, 2021
    Applicant: XCERRA CORPORATION
    Inventors: James Hattis, Travis Evans, Waqas Muzammil, Yukang Feng, Jason Mroczkowski, Marty Cavegn
  • TEST PROBE ASSEMBLY FOR HIGH FREQUENCY DEVICE CHARACTERIZATION
    Publication number: 20200116759
    Abstract: A test probe assembly includes a mounting fixture, a co-planar waveguide lead frame having a device contact point, where the co-planar waveguide lead frame is mounted to the mounting fixture, and at least one radio frequency (RF) connector assembly electrically coupled with the co-planar waveguide lead frame.
    Type: Application
    Filed: October 4, 2019
    Publication date: April 16, 2020
    Inventors: Jason Mroczkowski, Nadia Steckler, James Hattis, Ken Snyder, Scott Hanson
  • HIGH FREQUENCY CIRCUIT WITH RADAR ABSORBING MATERIAL TERMINATION COMPONENT AND RELATED METHODS
    Publication number: 20200083582
    Abstract: A high speed circuit assembly includes a high speed circuit including at least one transmission line extending to a transmission line end, and radar absorbing material disposed adjacent the transmission line.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 12, 2020
    Applicant: XCERRA CORPORATION
    Inventors: Jason Mroczkowski, Nadia Steckler, James Hattis, Aaren Lonks
  • Method and apparatus for improving thermal energy dissipation in a direct-chip-attach coupling configuration of an integrated circuit and a circuit board
    Publication number: 20060211461
    Abstract: A method and apparatus for improving the thermal conductivity of a circuit board (CB) assembly comprising an integrated circuit (IC) die mounted on a CB. A high thermal conductivity device is attached on a first end to a surface of the die. When the die is mounted on the CB, a void formed in the CB receives a second end of the HTC device, and the second end of the HTC device comes into contact with a portion of the CB. During operation of the die, heat produced by the die is dissipated through the HTC device and into the CB.
    Type: Application
    Filed: April 13, 2006
    Publication date: September 21, 2006
    Inventor: James Hattis