Patents by Inventor James Healy, Jr.

James Healy, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor substrate surface preparation using high temperature convection heating
    Patent number: 7063992
    Abstract: A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: June 20, 2006
    Assignee: Solid State Measurements, Inc.
    Inventors: Michael J. Adams, James Healy, Jr., William H. Howland, Jr.