Patents by Inventor James Healy

James Healy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150096305
    Abstract: A method and system for providing cooling of a turbine component that includes a region to be cooled is provided. A recess is defined within the region to be cooled, and includes an inner face. At least one support projection extends from the inner face. The at least one support projection includes a free end. A cover is coupled to the region to be cooled, such that an inner surface of the cover is coupled to the free end of the at least one support projection, such that at least one cooling fluid passage is defined within the region to be cooled.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: General Electric Company
    Inventors: Victor John Morgan, John Wesley Harris, Jr., Michael James Healy, Aaron Ezekiel Smith, Brian Gene Brzek, Donald Earl Floyd, II
  • Publication number: 20150044059
    Abstract: An airfoil includes a main portion formed of a base material. Also included is a trailing edge region of the main portion. Further included is a trailing edge supplement structure comprising at least one pre-sintered preform (PSP) material operatively coupled to the base material proximate the trailing edge region.
    Type: Application
    Filed: August 9, 2013
    Publication date: February 12, 2015
    Applicant: General Electric Company
    Inventors: Stephen Paul Wassynger, John Wesley Harris, JR., Michael James Healy
  • Patent number: 8371497
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: February 12, 2013
    Assignee: QUALCOMM Incorporated
    Inventor: Christopher James Healy
  • Publication number: 20100314433
    Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
    Type: Application
    Filed: June 11, 2009
    Publication date: December 16, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventor: Christopher James Healy
  • Publication number: 20100002719
    Abstract: An M-CMTS compatible UEQAM device implements circuitry to identify and analyze MAP message in the data stream sent from the M-CMTS Core with respect to timing information embedded in those messages. The improved UEQAM will then create a specific message as an extension to DEPI to communicate that information to the M-CMTS Core. The M-CMTS Core will employ that analysis to automatically adjust MAP message advance time to reduce delay and thus improve system performance. This invention will provide a closed-loop between the M-CMTS Core and the UEQAM where valuable transmission information will periodically be fed back from UEQAM-to-M-CMTS Core in real-time.
    Type: Application
    Filed: July 2, 2008
    Publication date: January 7, 2010
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Pawel Sowinski, Michael James Healy, John Torrence Chapman, Daniel Wilson Crocker
  • Publication number: 20070205327
    Abstract: The invention is sensor pod assembly for mounting sensor systems for an aircraft, the aircraft having a fuselage with a longitudinal axis. In detail the sensor pod includes an elongated pod having front and rear ends, the pod removable mountable to the underside of the fuselage of the aircraft aligned with the longitudinal axis. A mounting system is includes to mount at least one container capable of being pressurized in a plurality of locations within the pod along the longitudinal axis, the at least one container including means to mount the sensor systems there within.
    Type: Application
    Filed: March 6, 2006
    Publication date: September 6, 2007
    Inventors: Charles Gioffre, James Healy
  • Publication number: 20060185759
    Abstract: A fuel dispenser nozzle has a spout assembly for delivery of fuel into a vehicle fill pipe constructed to limit post-fueling dripping to an average of less than about three drops of fuel per fueling event.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 24, 2006
    Inventor: James Healy
  • Publication number: 20060183989
    Abstract: A biomedical electrode for transmitting and/or receiving electrical signals to/from a patient is disclosed. The electrode includes a metallized fabric, wherein metallization of the fabric is connected at least on a top side and a bottom side of the fabric so as to uniformly transmit or receive the electrical signals. A conductive gel adhesive in contact with the metallized fabric. The electrode can be fabricated using a continuous web process, thereby reducing the cost of manufacturing the electrode.
    Type: Application
    Filed: January 13, 2006
    Publication date: August 17, 2006
    Inventor: James Healy
  • Patent number: 7063992
    Abstract: A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.
    Type: Grant
    Filed: August 8, 2003
    Date of Patent: June 20, 2006
    Assignee: Solid State Measurements, Inc.
    Inventors: Michael J. Adams, James Healy, Jr., William H. Howland, Jr.
  • Publication number: 20060052683
    Abstract: A biomedical electrode for transmitting and/or receiving electrical signals to/from a patient is disclosed. The electrode includes a metallized fabric, wherein metallization of the fabric is connected at least on a top side and a bottom side of the fabric so as to uniformly transmit or receive the electrical signals. A conductive gel adhesive in contact with the metallized fabric. The electrode can be fabricated using a continuous web process, thereby reducing the cost of manufacturing the electrode.
    Type: Application
    Filed: August 17, 2005
    Publication date: March 9, 2006
    Inventors: Robert Parker, James Healy
  • Publication number: 20050241175
    Abstract: To remove and/or prevent contamination of a probe, at least a portion of the probe is positioned in a chamber having an inlet passage and an outlet passage, with a distal end of the probe extending through the outlet passage and terminating on a side thereof opposite the chamber. A gas is caused to flow through the inlet passage into the chamber and out the outlet passage, thereby modifying an environment surrounding the distal end of the probe. The gas may be heated prior to injection.
    Type: Application
    Filed: April 28, 2004
    Publication date: November 3, 2005
    Applicant: Solid State Measurements, Inc.
    Inventors: William Howland, James Healy
  • Publication number: 20050225345
    Abstract: A sheet resistance test of a wafer or sample can be performed by causing a plurality of spaced contacts, each of which either does not form oxides thereon or which forms conductive oxides thereon, to touch a surface of the wafer without penetrating or damaging the surface. An electrical stimulus is then applied to the wafer via one or more of the contacts and the electrical response of the semiconducting material to the electrical stimulus is detected via one or more of the contacts. At least one electrical property of the wafer can be determined from the measured response and the applied electrical stimulus.
    Type: Application
    Filed: April 5, 2005
    Publication date: October 13, 2005
    Applicant: Solid State Measurements, Inc.
    Inventors: Robert Mazur, Robert Hillard, James Healy
  • Publication number: 20050028836
    Abstract: A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.
    Type: Application
    Filed: August 8, 2003
    Publication date: February 10, 2005
    Inventors: Michael Adams, James Healy, William Howland
  • Patent number: 6635080
    Abstract: A prosthesis that resiliently engages a body passage includes an annular clamping ring which may be folded along a diametric axis for insertion into the body passage. The clamping ring is adapted to resiliently spring outwardly, once in position inside the body passage, and to be continually resiliently biased against the interior surface of the body passage. One or more of the clamping rings may be attached to opposed ends of a tubular graft. The rings and connected graft may be positioned in the body passage using a applicator which selectively permits expansion and/or in some embodiments contraction of the annular ring in position within a body passage. Alternatively a retaining member may be used to retain the annular ring in a compressed condition until it is in a desired position within a body passage. Among other potential uses, the present invention may be useful as a vascular stent for treating abdominal aortic aneurysms.
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: October 21, 2003
    Assignee: Vascutek Limited
    Inventors: Karl-Lutz Lauterjung, Kerry Elizabeth Flynn, Linda Ann O'Donnell, Karl James Healy, David Granville Stevenson
  • Patent number: 6555077
    Abstract: A process for the removal of organic impurities in a Bayer process liquor in which wet and dry oxidation processes are linked together in a complementary way, such that the weaknesses of each individual organic removal process become a strength of the combined process. An organics-rich liquor stream is fed to a wet oxidation process to produce a first processed liquor which is depleted in organic compounds, but enriched in sodium carbonate and/or sodium oxalate. A feed slurry is fed to the dry oxidation process, typically including a liquor burner, where sodium compounds react to produce a discharge product. The first processed liquor and discharge product are directed into a leach tank, resulting in the formation of precipitated products including sodium carbonate and/or sodium oxalate. The precipitated products are separated from the leach tank and recycled in a mix tank providing the feed slurry to the liquor burner.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: April 29, 2003
    Assignee: Worsley Alumina Pty. Ltd
    Inventors: Steven Philip Rosenberg, Wayne Tichbon, Steven James Healy
  • Patent number: 6141777
    Abstract: A system and method for reporting, directly to a customer, conditions of telecommunications services to which the customer subscribes. The system includes a server for collecting fault information from the telecommunications network management system and a customer workstation for viewing the information. The customer can use the workstation to define a view of the data he wishes to receive. The server builds reports using the view, and provides the reports to the customer.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: October 31, 2000
    Assignee: MCI Communications Corporation
    Inventors: George M. Cutrell, James Healy, William C. Holford, Dennis L. Maino, Michael J. O'Connor, Milton A. Steiner
  • Patent number: 5723849
    Abstract: A fiber reinforcement fabric contains a metal susceptor strip paired with each warp thread and woven with the weave thread to produce a thermoplastic welding susceptor of separated and electrically isolated, longitudinal metal strips and fiber reinforcement in the weld.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: March 3, 1998
    Assignee: The Boeing Company
    Inventors: Marc R. Matsen, Ronald W. Brown, James Healy, Karl A. Hansen, deceased, John J. deJong, executor