Abstract: An adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used. A kit for constructing an adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used. A method of assembling an adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used.

Abstract: An adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used. A kit for constructing an adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used. A method of assembling an adjustable ball joint which is infinitesimally adjustable using a jam nut wherein no set screws are used.

Abstract: The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.

Abstract: The present invention relates to a device package, such as an electronic system package, that is suitable for use in harsh military or commercial environments. The package components, including a base enclosure and mating cover, comprise a series of interconnected electrically conductive materials, forming a tortuous electrically conductive path, that advantageously shield electromagnetic interference (“EMI”). The electrically conductive, EMI-shielding layers and other coated layers (e.g., insulative electrocoated paint layers) are smooth layers that provide corrosion resistance to the interior and exterior surfaces of the package. The package is also designed such that its components form a water tight seal. Thus, innovatively, the package comprises a combination of components that synergistically shield electromagnetic interference, resist interior and exterior corrosion, and form a water tight seal. The package is configured to pass military specification EMI and salt fog standard testing.

Abstract: A method for characterizing exposure levels in a platesetter comprises exposing regions of a plate at different exposure levels by modulating the power of an exposure beam and then analyzing the plate after development to determine a desired exposure level for plates on the platesetter by reference to the regions receiving the different exposure levels. The plates are preferably exposed in an area outside of a printing area. In this way, the exposure test can be performed as part of the normal plate printing process. The plate is not consumed. Moreover, the plate exposure setting can be constantly monitored throughout production in one implementation.