Patents by Inventor James Henry Brown

James Henry Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through-the-substrate investigation of flip-chip IC's
    Patent number: 6518571
    Abstract: Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
    Type: Grant
    Filed: February 10, 2001
    Date of Patent: February 11, 2003
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher Graham Talbot, James Henry Brown
  • Through-the-substrate investigation of flip-chip IC's
    Publication number: 20010010356
    Abstract: Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
    Type: Application
    Filed: February 10, 2001
    Publication date: August 2, 2001
    Inventors: Christopher Graham Talbot, James Henry Brown
  • Through-the-substrate investigation of flip chip IC's
    Patent number: 6225626
    Abstract: Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
    Type: Grant
    Filed: September 30, 1998
    Date of Patent: May 1, 2001
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher Graham Talbot, James Henry Brown
  • Through-the-substrate investigation of flip-chip IC's
    Patent number: 5821549
    Abstract: Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: October 13, 1998
    Assignee: Schlumberger Technologies, Inc.
    Inventors: Christopher Graham Talbot, James Henry Brown