Abstract: Various systems and methods for implementing automatic thermal policy tuning are described herein. A system for thermal policy tuning on an electronic device, comprising: a memory device configured to store instructions; and a processor subsystem, which when configured by the instructions, is operable to perform the operations comprising: accessing a thermal policy configuration comprising a plurality of parameters to control a thermal policy of the electronic device; using the thermal policy configuration as input to a machine-learning algorithm, the machine-learning algorithm using an objective function to determine a revised thermal policy configuration; and implementing the revised thermal policy configuration on the electronic device.

Abstract: A method includes measuring a temperature of a device, determining a voltage applied to the device, determining a leakage power for the device in real time based on the measured temperature and determined voltage and estimating an active power for the device. The method also includes adding the determined leakage power and the estimated active power to estimate a total power value associated with the device, and controlling the device based on the total power value.

Abstract: Systems and methods of operating a cooling system provide for determining one or more cooling requirements of a computing system and controlling one or more vent valves of the cooling system based on the cooling requirements. In one approach, the cooling requirements are determined based on operating system state data and/or power management data.

Abstract: According to one embodiment, a method of managing power generated within a computer system, the method includes operating the computer system at a first central processing unit (CPU). Subsequently, a first signal generated by a thermal sensor within the first CPU is received and operation of the computer system at is resumed at a second CPU.

Abstract: A system includes a housing, a support structure (e.g., a circuit board), and an electronic device mounted on the support structure. A heat dissipation apparatus is thermally coupled to the electronic device and the housing to direct heat from the electronic device into the housing. The heat dissipation apparatus may include layers of thermally conductive members coupled between the electronic device and the housing. In addition, the heat dissipation apparatus may be thermally coupled to the support structure to direct heat from the electronic device to the support structure.