Abstract: The system contains a device and a defining signature of at least one characteristic of the device. The defining signature changing as the device accumulates damage through a period of useful lifetime in a damaged state. A sensor is in communication with the device. The sensor sensing at least one of the characteristics of the defining signature as the device accumulates damage through the period of useful lifetime. A predictive curve is provided with the defining signature mapped over the anticipated useful lifetime of the device in the damaged state. The predictive curve provides a preliminary prediction of the remaining useful lifetime of the device in the damaged state. A reasoner is in communication with the sensor. The reasoner modifies the predictive curve relative to the sensed defining signature, thereby providing a normalization of the defining signature to the predictive curve.

Abstract: The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.

Abstract: A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply voltage used to power the package. Resistors R1 and R2 are connected in series at a first junction between the high and low supply voltages and a resistor R3 is coupled to the high supply voltage and connected in series with the resistance of the solder-network at a second junction. The network is held at a low voltage on the die. The detector compares the sensitivity and detection voltages and outputs a Pass/Fail signal for the solder-joint network.