Patents by Inventor James Huckabee

James Huckabee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11018111
    Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.
    Type: Grant
    Filed: May 27, 2019
    Date of Patent: May 25, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rongwei Zhang, James Huckabee, Vikas Gupta
  • Publication number: 20200381390
    Abstract: A leadless integrated circuit (IC) package includes a spaced apart plurality of lead terminals on at least two sides of the leadless IC package, and an IC die including a substrate having at least a semiconductor surface including circuitry coupled to bond pads with the bond pads having bonding features thereon. The bonding features are flip chip bonded to the plurality of lead terminals. Mold compound is above the IC die and between adjacent lead terminals. The lead terminals and the substrate both extend out to have exposed surfaces at edges of the leadless IC package, and the lead terminals also provide a back side bondable contact.
    Type: Application
    Filed: May 27, 2019
    Publication date: December 3, 2020
    Inventors: Rongwei Zhang, James Huckabee, Vikas Gupta
  • Patent number: 7712999
    Abstract: A method and apparatus for drying soil wherein a soil drying machine is adapted to traverse an area of soil and to dry the soil in the process. The soil drying machine includes a main frame having an air generating device, such as a blower, and a heater mounted thereon. A system of heated air is generated on the soil drying machine and directed downwardly into engagement with the soil being dried. Forming a part of the soil drying machine is a tilling implement. From time-to-time the tilling implement can be lowered and engaged with the soil so as to till the soil prior to the soil being subjected to the heated air, or after the soil has been subjected to the heated air. The soil drying machine may be in the form of a self-propelled unit or a pull-type unit configured to be pulled by a tractor.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: May 11, 2010
    Inventor: James Huckabee