Abstract: A parking meter may have a housing that is formed at least significantly of an impact resistant material. In particular, the impact resistant material may comprise one of a polycarbonate copolymer or polycarbonate blended resin, a nylon-based copolymer, or a nylon-based polymer that includes long glass fiber or Kevlar fiber. The housing encloses the parking meter components to provide protection for the parking meter components against an external environment and vandalism attacks.

Abstract: Various implementations disclosed herein include devices, systems, and methods for generating variations of an object. In various implementations, a device includes a display, a non-transitory memory and one or more processors coupled with the display and the non-transitory memory. In some implementations, a method includes obtaining a request to populate an environment with variations of an object characterized by at least one visual property. In some implementations, the method includes generating the variations of the object by assigning corresponding values for the at least one visual property based on one or more distribution criterion. In some implementations, the method includes displaying the variations of the object in the setting in order to satisfy a presentation criterion.

Abstract: A parking meter may incorporate a touchscreen display assembly that uses a low-power wake trigger, which may be a proximity sensor overlaid on the display, that can power on the display and touch sensor when a user's proximity is detected. The parking meter may incorporate a replaceable panel insert that allows user interface components to be easily retrofitted or upgraded by simply replacing the panel insert. Additionally, the parking meter may incorporate multiple solar panels on the exterior of the parking meter.

Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.

Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.