Patents by Inventor James Ignatius

James Ignatius has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional power supply module with passive stacked over cavity
    Patent number: 9300222
    Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: March 29, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: James Ignatius Moss
  • THREE-DIMENSIONAL POWER SUPPLY MODULE WITH PASSIVE STACKED OVER CAVITY
    Publication number: 20150070850
    Abstract: A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching assemblage includes a load inductor component stack attached to a power transistor block and an interconnect spacer block, defining a cavity between the two blocks. The power transistor block includes a high and low side FETs attached side-by-side to a switch-node metal carrier that includes an attach-surface opposite the FETs. The power switching assemblage is mountable to an interconnect surface that includes connection pads VIN, VOUT, GND, HG (high-side gate) and LG low-side gate). For a module configuration, the power switching assemblage is combined with a driver IC that provides high (HG) and low (LG) gate drive—the power switching assemblage and the driver IC are mounted to a module interconnect substrate, with the driver IC mounted within the cavity of the power switching assemblage.
    Type: Application
    Filed: September 11, 2014
    Publication date: March 12, 2015
    Inventor: James Ignatius Moss
  • Heated dry rack or the like
    Patent number: D314262
    Type: Grant
    Filed: December 30, 1988
    Date of Patent: January 29, 1991
    Assignee: Whirlpool Corporation
    Inventors: Gerald L. Kretchman, James Ignatius