Abstract: An apparatus and method is disclosed for transporting thin materials, such as printed circuit boards or films, in an etching or other chemical treatment operation whereby a series of guide members, such as wires, which move back and forth in a reciprocating manner, guide the articles being transported through the apparatus and facilitate generally uniform treatment coverage of the articles with a treatment fluid.

Abstract: A method and apparatus is provided for chemically treating articles, often with a liquid treatment fluid that is corrosive, while the articles are being delivered along a path through a substantially closed chamber. During treatment, the articles pass through a nip formed between opposed rollers. Because of the thin flexible nature of the articles, they may tend to wrap around a roller after passing through the nip. The articles are engaged as they pass downstream of the nip and are urged away from the surface of the roller, to continue to follow a predetermined path of travel. In engaging the articles to urge them away from the nip, they are preferably contacted by eccentrically mounted rings, carried by the roller. The rings have portions that protrude away from the surface of the roller that enables them to engage the article.

Abstract: A method and apparatus is provided for chemically treating articles, generally in a corrosive environment by etching or the like, where a corrosive substance is applied to the articles being delivered through a substantially closed chamber. The chamber is provided with access through an openable door, and a seal is provided between the door and the wall of the chamber. The seal is flexible and is inflatable, to prevent a treatment fluid with which articles are being treated within the chamber, from being dispersed from inside the chamber to outside the chamber at the juncture of the door with the wall of the chamber in which the door is located. The seal is expanded by means of a fluid pressure, and is releasable upon desired access to the chamber.

Abstract: Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction.

Abstract: Printed circuit boards are carried generally vertically, along a path, with the tabs at the lower end being immersed in an electrolyte. The boards are automatically conveyed through opposed serially arranged pairs of rollers, which drive them along their path. Brushes wipe the boards to prevent contact with electrolyte above the desired contact level, as they are conveyed along the path. The solution is constantly replenished and turbulence provided by delivering electrolyte solution, with insoluble metallic ions in it, by pumping the solution from a sump, through an array of nozzles along each side of the path, thus providing fresh electrolyte along with providing turbulence to the electrolyte. The nozzles are charged at a sufficiently low level to avoid their destruction.