Abstract: A honeycomb substrate includes an inner body having an inner skin and an array of inner webs defining an array of inner cells within the inner skin. The honeycomb substrate further includes an outer body having an outer skin formed concentric with the inner skin and an array of outer webs defining an array of triangle cells between the inner skin and the outer skin. The triangle cells are oriented along a radial direction with respect to a center of the inner body. An extrusion assembly for forming the honeycomb substrate includes an inner cell forming die, an outer cell forming die, and a skin forming mask, all mounted coaxially. An outer skin slot formed between the outer cell forming die and the skin forming mask is in communication with feedholes in the inner cell forming die through an opening in the outer cell forming die.

Abstract: A method for forming EUV LITHOGRAPHY GLASS STRUCTURES WITH VOIDS is disclosed which includes forming a slurry mixture including silica soot particles, and inserting the slurry mixture into a casting mold. The method provides low weight mass reduced rigid glass structures with beneficial thermal stability. The casting mold includes therein a casting form. The casting form is adapted to provide selected geometry void spaces within the glass lithography structure. The slurry mixture is dried to form a green ware object. The casting form is removed from the green ware and the green ware object is consolidated into a lithography glass structure with voids.

Abstract: Extruded honeycomb products are formed by means of an extrusion die incorporating a pin support section positioned between the die body and the pin array forming the die discharge slots, the pin support providing enlarged support segments that improve pin stability and die resistance to pin damage without overly restricting batch flow through the die.

Abstract: A honeycomb substrate includes an inner body having an inner skin and an array of inner webs defining an array of inner cells within the inner skin. The honeycomb substrate further includes an outer body having an outer skin formed concentric with the inner skin and an array of outer webs defining an array of triangle cells between the inner skin and the outer skin. The triangle cells are oriented along a radial direction with respect to a center of the inner body. An extrusion assembly for forming the honeycomb substrate includes an inner cell forming die, an outer cell forming die, and a skin forming mask, all mounted coaxially. An outer skin slot formed between the outer cell forming die and the skin forming mask is in communication with feedholes in the inner cell forming die through an opening in the outer cell forming die.

Abstract: Extruded honeycomb products are formed by means of an extrusion die incorporating a pin support section positioned between the die body and the pin array forming the die discharge slots, the pin support providing enlarged support segments that improve pin stability and die resistance to pin damage without overly restricting batch flow through the die.

Abstract: A method of making an EUV lithography stage structure includes depositing a layer of a Ti doped SiO2 glass powder in a confined region to provide an underlying layer; applying a binder to form a primitive with the binder bonding the glass powder together at one or more selected regions; depositing an above layer of the glass powder above the deposited layer; applying the binder to the above layer with the binder bonding the glass powder together at one or more selected regions; repeating the deposition and binding steps to produce a number of successive layers with the binder bonding the successive layers together; and removing the unbonded glass powder to provide a bonded glass powder lithography stage structure which is then sintered and densified into a densified nonpowder glass lithography stage.

Abstract: A method for forming EUV LITHOGRAPHY GLASS STRUCTURES WITH VOIDS is disclosed which includes forming a slurry mixture including silica soot particles, and inserting the slurry mixture into a casting mold. The method provides low weight mass reduced rigid glass structures with beneficial thermal stability. The casting mold includes therein a casting form. The casting form is adapted to provide selected geometry void spaces within the glass lithography structure. The slurry mixture is dried to form a green ware object. The casting form is removed from the green ware and the green ware object is consolidated into a lithography glass structure with voids.

Abstract: The invention provides a method of making an EUV lithography stage structure for use in a semiconductor microlithography with EUV (extreme ultraviolet) radiation, where the stage is utilized to hold and support a substrate such as a mask or wafer.