Abstract: An apparatus and method for applying a uniform coating of liquid solder to a flat tube particularly at and adjacent to the side edges of the tube. The apparatus has spaced heated platens comprising shaping die members located opposite to each other and including tube embracing recesses forming a slot through which the liquid solder coated tube is passed. The disclosure also includes spacing means for spacing these die members apart a distance equal to the width of the coated tubes and yieldable means such as springs urging the spaced heated platens toward each other to bear against the side edges of the tube together with means for drawing the coated tube between the heated platens and means for heating the platens in the vicinity of the tube to a temperature above the melting point of the solder as well as passages permitting draining of excess solder from the tube during its passage between the heated platens.

Abstract: An apparatus and method for applying a uniform coating of liquid solder to a flat tube particularly at and adjacent to the side edges of the tube. The apparatus has spaced heated platens comprising shaping die members located opposite to each other and including tube embracing recesses forming a slot through which the liquid solder coated tube is passed. The disclosure also includes spacing means for spacing these die members apart a distance equal to the width of the coated tubes and yieldable means such as springs urging the spaced heated platens toward each other to bear against the side edges of the tube together with means for drawing the coated tube between the heated platens and means for heating the platens in the vicinity of the tube to a temperature above the melting point of the solder as well as passages permitting draining of excess solder from the tube during its passage between the heated platens.