Abstract: A modular coating apparatus is disclosed which is adapted to couple to a host system, such as a cluster or in-line type coating system, as well as to operate in stand-alone fashion. The coating apparatus uses extrusion to initially deposit a film having a desired thickness. The substrate upon which the film is deposited may be spun to further distribute the film. Various embodiments of the coating apparatus are disclosed including embodiments utilizing a shim to mask the substrate and embodiments utilizing a rotatable chuck to facilitate cleaning of the substrate and/or the chuck. Preferably the various embodiments are sub-modules which may be interchanged in the main module as desired.