Patents by Inventor James J. DiPiazza

James J. DiPiazza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of using absorptive layer in optical lithography with overlying photoresist layer to form relief pattern on substrate
    Patent number: 4609614
    Abstract: A multilayer, photoresist recording medium is disclosed which comprises an absorptive layer and an oxygen plasma-resistant photoresist layer thereover. The structure is substantially free of intermixing of the two layers and separation of the photoresist layer during processing. The absorptive layer is formed by a two-step curing of a composition comprising a solution of a multifunctional acrylate or methacrylate monomer, a suitable dye and a photoinitiator in a suitable solvent. A coating of this composition is rapidly solidified to form an absorptive layer by high intensity irradiation and then baked to remove residual solvent and assure complete polymerization of the monomer.
    Type: Grant
    Filed: June 24, 1985
    Date of Patent: September 2, 1986
    Assignee: RCA Corporation
    Inventors: Thomas R. Pampalone, Ahmad H. Khan, James J. DiPiazza